公开(公告)号：US3678214A

公开(公告)日：1972-07-18

申请号：US3678214D

申请日：1970-08-21

Applicant: SONY CORP

Inventor： MIURA YOTARO ,  ITO MAKOTO

IPC: G11B15/61 ,  G11B15/665 ,  G11B5/76

CPC classification number: G11B15/6653 ,  G11B15/61

Abstract: A mechanism for automatically removing a magnetic tape from around a drum having magnetic heads therein for recording and playing back signals on the magnetic tape. An arm which is pivoted has one end which bears against the tape. A slide member moves the arm upwardly and away from the tape to eject the tape up and away from the rotating drum. The rotary movement of the drum facilitates the ejection of the tape.

Abstract translation: 用于在其周围磁盘周围自动移除磁带的机构，用于在磁带上记录和重放信号。 枢转的臂具有一端支撑在胶带上。 滑动构件将臂向上移动并远离带，以将带向上并远离旋转的滚筒。 滚筒的旋转运动便于弹出胶带。

公开(公告)号：SE0102020L

公开(公告)日：2001-12-17

申请号：SE0102020

申请日：2001-06-08

Applicant: SONY CORP

Inventor： SAITO EIJI ,  SUZUKI MASATOSHI ,  TAZOE MINORU ,  ITO MAKOTO ,  SEGAWA YUJI

IPC: C25D1/00 ,  C25D1/10 ,  G11B7/26

Abstract: An electroforming apparatus comprises a container unit for storing a plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part.

公开(公告)号：SG60102A1

公开(公告)日：1999-02-22

申请号：SG1997002893

申请日：1997-08-11

Applicant: SONY CORP

Inventor： SHIGETA HIROYUKI ,  OSAWA KENJI ,  SATO KAZUHIRO ,  MAKINO HARUHIKO ,  ITO MAKOTO

IPC: H01L23/31 ,  H01L21/60 ,  H01L23/04 ,  H01L23/50

公开(公告)号：SE522226C2

公开(公告)日：2004-01-27

申请号：SE0102020

申请日：2001-06-08

Applicant: SONY CORP

Inventor： SAITO EIJI ,  SUZUKI MASATOSHI ,  TAZOE MINORU ,  ITO MAKOTO ,  SEGAWA YUJI

IPC: C25D1/00 ,  C25D1/10 ,  G11B7/26

Abstract: An electroforming apparatus comprises a container unit for storing a plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part.

公开(公告)号：GB2365024B

公开(公告)日：2002-07-31

申请号：GB0114657

申请日：2001-06-15

Applicant: SONY CORP

Inventor： SAITO EIJI ,  SUZUKI MASATOSHI ,  TAZOE MINORU ,  ITO MAKOTO ,  SEGAWA YUJI

IPC: C25D1/00 ,  C25D1/10 ,  G11B7/26 ,  C25D17/02

Abstract: An electroforming apparatus comprises a container unit for storing a plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part.

公开(公告)号：GB2365024A

公开(公告)日：2002-02-13

申请号：GB0114657

申请日：2001-06-15

Applicant: SONY CORP

Inventor： SAITO EIJI ,  SUZUKI MASATOSHI ,  TAZOE MINORU ,  ITO MAKOTO ,  SEGAWA YUJI

IPC: C25D1/00 ,  C25D1/10 ,  G11B7/26 ,  C25D17/02

Abstract: An electroforming apparatus comprises a container unit for storing a plating solution, a cathode part placed in the container unit 120 and for holding an object to-be-plated and an anode part 140 placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part. The current-conductive opening of the cathode part may be formed of a current-conductive ring (123, Fig 3) around the peripheral edge of the optical disc master. The current-conductive opening in the anode is produced by using a titanium basket in the shape of reticulated meshes containing nickel balls. A diaphragm 230 and a shield plate 210 may be disposed between the titanium basket and the object to be plated on the cathode part and these are also in face-to-face arrangement. The cathode part is rotatable.

公开(公告)号：SG60099A1

公开(公告)日：1999-02-22

申请号：SG1997002878

申请日：1997-08-08

Applicant: SONY CORP

Inventor： OSAWA KENJI ,  SATO KAZUHIRO ,  ITO MAKOTO

IPC: H01L23/24 ,  H01L23/495 ,  H01L23/12 ,  H01L21/60 ,  H01L23/50 ,  H01L23/28

Abstract: A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection thermals are formed on the film circuit so as to project there from. First leads electrically connect part of the electrode pads to part of the external connection terminals. A second lead electrically connects a grounding or power supply electrode pad to the outer ring, and a third lead electrically connects a grounding or power supply external connection terminal to the outer ring.

公开(公告)号：SE0102020D0

公开(公告)日：2001-06-08

申请号：SE0102020

申请日：2001-06-08

Applicant: SONY CORP

Inventor： SAITO EIJI ,  SUZUKI MASATOSHI ,  TAZOE MINORU ,  ITO MAKOTO ,  SEGAWA YUJI

IPC: C25D1/00 ,  C25D1/10 ,  G11B7/26 ,  C25D

Abstract: An electroforming apparatus comprises a container unit for storing a plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part.

公开(公告)号：DE2058257A1

公开(公告)日：1971-08-05

申请号：DE2058257

申请日：1970-11-26

Applicant: SONY CORP

Inventor： MIURA YOTARO ,  ITO MAKOTO

IPC: G11B15/61 ,  G11B15/665 ,  G11B15/60

公开(公告)号：DE2632214A1

公开(公告)日：1977-02-03

申请号：DE2632214

申请日：1976-07-16

Applicant: SONY CORP

Inventor： TAMURA TOSHIO ,  OUCHI SHIGEO ,  OSAWA KENJI ,  FUEKI SHIMETOMO ,  TAKAHASI MAKOTO ,  ITO MAKOTO

IPC: C25D3/14 ,  C25D15/02 ,  C25D15/00 ,  C25D3/12