Abstract:
A film of a II - VI group compound semiconductor of at least one of elements belonging to the II group of the periodic table and at least one of elements belonging to the VI group of the periodic table is deposited on a substrate. When the film is deposited on the substrate, a plasma of nitrogen in an excited state is applied to the substrate while removing charged particles from said plasma by a charged particle removing means. The deposited film of a nitrogen-doped II - VI group compound semiconductor has an increased percentage of activated nitrogen atoms and improved crystallinity.
Abstract:
Una película de un semiconductor compuesto del grupo II - VI de por lo menos uno de los elementos que pertenecen al grupo II de la tabla periodica, y por lo menos uno de los elementos que pertenecen al grupo VI de la tabla periodica se deposita sobre un substrato. Cuando la película se deposita sobre el substrato, se aplica un plasma de nitrogeno en estado excitado al substrato mientras que se remueven las partículas cargadas del plasma mediante un medio de remocion de partícula cargada. La película depositada del semiconductor compuesto del grupo II - VI adulterado con nitrogeno tiene un porcentaje aumentado de átomos de nitrogeno activados y cristalinidad mejorada.
Abstract:
A film of a II - VI group compound semiconductor of at least one of elements belonging to the II group of the periodic table and at least one of elements belonging to the VI group of the periodic table is deposited on a substrate. When the film is deposited on the substrate, a plasma of nitrogen in an excited state is applied to the substrate while removing charged particles from said plasma by a charged particle removing means. The deposited film of a nitrogen-doped II - VI group compound semiconductor has an increased percentage of activated nitrogen atoms and improved crystallinity.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light emitting device having an elongated lifetime and improved reliability. SOLUTION: A method by this invention is a method for manufacturing a semiconductor light emitting device, which is constituted with II-VI group compound semiconductors, wherein the II group comprises at least one or more elements out of Zn, Be, Mg, Cd and Hg, and the VI group comprises at least one or more elements out of Se, S and Te, and which has first and second conducting-type cladding layers, 3 and 7, and an active layer, wherein the active layer is grown by specifying the feeding ratio VI/II of the VI group element(s) to the II group element(s) to be greater than 1.1 in the film growth for the active layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor element, which can perform a processing of good accuracy on the element without depending greatly rate of etching a semiconductor layer containing a group II element such as zinc(Zn), and a group VI element such as selenium (Se), on the material constituting the layer. SOLUTION: A buffer layer 2, a first group II-VI buffer layer 3, a second group II-VI buffer layer 4, a first conductivity type clad layer 5, a first guide layer 6, an active layer 7, a second guide layer 8, a second conductivity type clad layer 9, a first semiconductor layer 10, a second semiconductor layer 11, a superlattice layer 12 and a contact layer 13 are epitaxially grown in order on the surface of a substrate 1, Thereafter, a resist film 20 of a striped pattern is formed on the layer 13. A wet etching is performed using the resist film 20 as a mask and the layers 13, 12 and 11 are selectively removed. As an etchant, a mixed solution containing hydrogen peroxide (H2 O2 ), hydrogen fluoride(HF) and a hydrochloric acid (HCl) is used.
Abstract:
PURPOSE: To provide a method for obtaining the crytical film thickness of an active layer or the like of an optical semiconductor device composed of a II-VI compound semiconductor layer, and form the optical semiconductor device under the optimum condition. CONSTITUTION: The relation between the film thickness of a compound semiconductor layer and the PL intensity is obtained by observing photoluminescence(PL) of the compound semiconductor layer which PL corresponds with the film thickness. The film thickness wherein the PL intensity forms a peak IP is obtained as the critical film thickness hPL. A relational equation for approximating the critical film thickness by setting the composition ratio of cadmium(Cd) in the compound semiconductor layer as a function is obtained. By using the relational equation, the critical film thickness of the compound semiconductor layer having a desired Cd composition ratio is obtained. The film thickness of the active layer is designed to be less than or equal to the critical film thickness obtained in the above manner. The active layer is formed to have the film thickness designed when a II-VI compound semiconductor layer containing an active layer is deposited on a substrate, and an optical semiconductor device is formed.
Abstract:
PURPOSE:To improve an oscillation performance by heightening a crystallizability of an active layer and a guide layer or peripheral layers thereof. CONSTITUTION:This is a semiconductor device 1 where a plurality of II-VI group compound semiconductor layers 12 are formed on a semiconductor substrate 11 consisting of a III-V group compound semiconductor and where at least one set or more of superlattices 23 are formed of a II-VI group compound semiconductor in a clad layer 22 of n-type conduction of the II-VI group compound semiconductor layer 12 or between a clad layer 22 and a guide layer 24. Further, this photosemiconductor device is provided with at least one set or more of superlattices of the semiconductor base body 11 and the II-VI group semiconductor layer 12. Or, this photosemiconductor device is provided with at least one set or more superlattices formed of the II-VI group compound semiconductor between the guide layer 24 and an active layer 25.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element, capable of easily lowering an operating voltage, the manufacture and an optical device. SOLUTION: An (n)-type clad layer 5, a first guide layer 6, an active layer 7, a second guide layer 8, a (p)-type clad layer 9, a first semiconductor layer 10 and a second semiconductor layer 11 composed of ZnSe are successively laminated on the substrate 1 of an (n)-type and an alkali compound layer composed of Na2 Se is formed on it. Then, irradiation with an excimer laser beam is performed, a heating processing is performed, a part of the second semiconductor layer 11, at least a part of the alkali compound layer are changed and a contact layer 12 is formed. Then, a (p) side electrode 14 is formed on the contact layer 12. The contact layer 12 contains alkali metal as (p)-type impurities and electric resistance is low. Thus, the operating voltage is lowered, an operation is performed with less power, and the service life is prolonged.
Abstract:
PURPOSE: To provide a semiconductor light emitting device utilizing a II-VI group compound semiconductor which assures long term stabilized operation with the continuous oscillation under the room temperature. CONSTITUTION: In a semiconductor light emitting device where the principal part 3 of a semiconductor light emitting device using a II-VI group compound semiconductor is formed on a GaAs substrate 1 through lattice matching with this GaAs substrate 1, the principal part 3 of the semiconductor light emitting device is formed on the GaAs substrate 1 through an interface layer sequentially forming at least GaAs buffer layer 11 and ZnSe layer 12 and at least a partial thickness of the ZnSe layer 12 in the side of the GaAs buffer layer is formed as the non-doped ZnSe layer 12a.
Abstract:
PURPOSE: To provide a molecular beam epitaxial device (an MBE device), in which crystal growth is conducted while accurately measuring the intensity of molecular beams. CONSTITUTION: A substrate 10 arranged into a growth chamber 2 and ion gauges 5a-5c, vessels 3a-3c for storing materials A-C grown on the substrate 10, and a power supply 6 for heating, which heats the materials A-C stored in the vessels 3a-3c and emits molecular beams, are provided, and two or more of molecular beams having correlation regarding intensity are emitted linearly in different directions from the vessels 3a-3c respectively. The substrate 10 is irradiated with at least one molecular beam 1' in the molecular beams and the ion gauges 5a-5c are irradiated with at least one molecular beam 2' in others at the same time in an MBE device 1.