Abstract:
There is provided a method of manufacturing an electronic element for forming the electronic element including one or more wiring layers and an organic insulating layer stacked on a substrate. The method includes a wiring layer formation step of forming the wiring layer on the substrate; an organic insulating layer formation step of forming an organic insulating layer on the wiring layer; and an irradiation step of irradiating a short-circuit portion of the wiring layer through the organic insulating layer with a laser beam having a wavelength transmissive through the organic insulating layer.
Abstract:
There is provided a method of manufacturing an electronic element for forming the electronic element including one or more wiring layers and an organic insulating layer stacked on a substrate. The method includes a wiring layer formation step of forming the wiring layer on the substrate; an organic insulating layer formation step of forming an organic insulating layer on the wiring layer; and an irradiation step of irradiating a short-circuit portion of the wiring layer through the organic insulating layer with a laser beam having a wavelength transmissive through the organic insulating layer.
Abstract:
A wiring layer short circuit portion is repaired using a laser beam transmitted through the organic insulating layer 12 or the substrate 11 to remove the short circuit. The irradiation treatment creates a cavity 25 between the remaining portions of the separated wirings layers. The organic insulator and/or the substrate are transparent to the laser light used. The repair method may be used for manufacturing flexible OLED touch sensitive displays or organic solar cell arrays.
Abstract:
A wiring layer short circuit portion 24 is repaired using a laser beam transmitted through the organic insulating layer 12 or the substrate 11 to remove the short circuit. The irradiation treatment creates a cavity between the remaining portions of the separated wirings layers. The organic insulator and/or the substrate are transparent to the laser light used. The repair method may be used for manufacturing flexible OLED touch sensitive displays or organic solar cell arrays.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same by which a time for writing is reduced without reducing a storage-keeping time. SOLUTION: In the semiconductor device having structure obtained by laminating a first tunnel insulated film, a second tunnel insulated film, an electric charge accumulation layer, a blocking insulated film and a gate electrode on a semiconductor substrate where a source and a drain are formed, the time for writing is reduced and the storage-keeping time is extended by utilizing a diode effect by setting the first tunnel insulated film of SiO x and the second tunnel insulated film of SiO 2 . COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming an organic thin film capable of forming a single crystal organic thin film quickly and easily while controlling the thickness and size.SOLUTION: After supplying organic solution 20 to one surface of a film deposition substrate 10 (a wide solution storage region 11 and a narrow solution constriction region 12 connected thereto) supported by a temperature controllable support 1, a temperature controllable moving body 4 is moved along the surface of the support 1 while touching the organic solution 20 independently from the support 1. Temperature TS of the support 1 is set between the solubility curve and supersolubility curve for the organic solution 20, and the temperature TM of the moving body 4 is set on the higher temperature side than the solubility curve.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method which prevents ink oozing or traveling to back side by screen printing with a stabilized printed shape, and also a method of manufacturing a semiconductor device using the pattern forming method. SOLUTION: In the pattern forming method and the method of manufacturing a semiconductor device having a source/drain electrode 12, a gate insulated film, an organic semiconductor layer, and a gate electrode laminated in this order on a substrate 11 using the pattern forming method; a liquid repellent layer A 1 is formed on the substrate 11 with a conductive film 12' disposed therebetween, and then a resist ink pattern R 1 ' is printed by screen printing to form a resist pattern R 1 on the liquid repellent layer A 1 , and the conductive film 12' is etched with use of the resist pattern R 1 as a mask to form the source/drain electrode 12. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a display device which controls driving of pixels by TFTs and auxiliary capacitors and in which an aperture ratio can be maximized while a voltage retention is sufficiently maintained. SOLUTION: The display device is equipped with a drive circuit substrate 118, a counter substrate 119, and a liquid crystal layer 112 sealed between the two substrates. The drive circuit substrate 118 has the organic TFT 117 for driving control corresponding to each pixel and the auxiliary capacitor section 120. The source electrode 108, drain electrode 109, and gate electrode 104 of the organic TFT 117 and the auxiliary capacitor electrode 103 of the auxiliary capacitor section 120, and particularly the auxiliary capacitor electrode 103 are formed of transparent conductive materials to maximize the aperture ratio. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a non-volatile semiconductor storage device with little variation in electric characteristics among memory cells. SOLUTION: A floating gate electrode 7 provided on a substrate 1 comprises two or more kinds of materials with different carrier capturing efficiencies. The carrier is accumulated at the floating gate electrode 7 for storing data to constitute a region with little variation of a threshold voltage. The part with little variation is used as a margin for circuit operation, for less variation among cells and faster operation.
Abstract:
PROBLEM TO BE SOLVED: To provide a method which can form semiconductor dots as desired, while making a semiconductor film polycrystalline without spoiling the planarity of the top surface of a polycrystalline silicon layer and a tunnel oxide film and can easily manufacture a memory element, having a fine particle floating gate easily at a low cost, even when the substrate is made of glass or plastic. SOLUTION: This manufacturing method includes a step for making a semiconductor film polycrystalline by performing a 1st laser annealing process, after forming the semiconductor film on a substrate 1, a step for forming a semiconductor dot forming film 7 of non-stoichiometric composition containing semiconductor elements excessively on the semiconductor film, and a stage for forming semiconductor dots by dispersing particulates of a semiconductor in the semiconductor dot forming film, by performing a 2nd laser annealing process, and the pulse energy density of the laser used for the 1st laser annealing process is set larger than the pulse energy density of the laser used for the 2nd laser annealing process.