中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

25 records (took 0.026 seconds)

    LEAD FRAME FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE
    5.
    发明专利
    LEAD FRAME FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE 失效

    公开(公告)号：JPH09153581A

    公开(公告)日：1997-06-10

    申请号：JP31334395

    申请日：1995-11-30

    Applicant: SONY CORP

    Inventor： KOBAYASHI FUJIO ,  TAWARA MASAKAZU

    IPC: H01L21/56 ,  H01L23/50

    Abstract: PROBLEM TO BE SOLVED: To eliminate burrs so as to rationalize the process, downsize a sealing device and reduce the cost and the amount of resin material. SOLUTION: A lead frame 10, which is integrally formed by using conductive metal thin board as material, is provided. On the lead frame 10, a chip mounting part 11 whereupon a semiconductor chip 2 is to be mounted, many punched out lead terminal pieces, a resin supply part 17 and a runner part 18 are formed. On the lead frame 10, sealing resin 5 which seals the semiconductor chip 2 by exposing the leading edge of each lead terminal piece is outsert-molded. The resin supply part 17 is formed within the same plane as the resin filling area 13 of resin material, and a part of the runner part is prevented from crossing the lead frame 10.

    LEAD FRAME, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE DEVICE
    6.
    发明专利
    LEAD FRAME, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE DEVICE 失效

    公开(公告)号：JPH08227964A

    公开(公告)日：1996-09-03

    申请号：JP5649495

    申请日：1995-02-21

    Applicant: SONY CORP

    Inventor： KOBAYASHI FUJIO ,  TAWARA MASAKAZU

    IPC: H01L23/04 ,  C04B28/00 ,  H01L23/50

    Abstract: PURPOSE: To realize high mounting while realizing compactness by enlarging a lead pitch interval at a solder land part by providing a lead pattern which extends radially around a die pad arranged in a central part of a conductive disc member. CONSTITUTION: A circular lead frame wherein a lead is extended radially from a die pad at a central part is completed by punching a lead frame element material 9 formed to prepare one IC package to one lead frame by a press. Then, a semiconductor chip 5 is die-bonded to the lead frame 10. After a gold line 7 is wire-bonded, it is formed by molding by using resin 8. Then, resin burr 11 between leads 6 is removed by a process in a press die, a die bar 12 and an outer circumferential ring 13 are pulled down, lead bending processing is performed for the lead 6 by a punch and a die of a circular die set and a semiconductor integrated circuit is completed.

    CONTACT TYPE POSITION DETECTING DEVICE
    7.
    发明专利
    CONTACT TYPE POSITION DETECTING DEVICE 失效

    公开(公告)号：JPH0729445A

    公开(公告)日：1995-01-31

    申请号：JP19509593

    申请日：1993-07-12

    Applicant: SONY CORP

    Inventor： KOBAYASHI FUJIO ,  WATANABE YOSHIRO

    IPC: G01B7/00 ,  G01D5/165 ,  H01H1/60 ,  H01H19/08 ,  H01H21/12

    Abstract: PURPOSE:To provide a contact type position detecting device in which a contact failure by refuse or dust is surely eliminated at low cost in a saved space. CONSTITUTION:In a contact type position detecting device in which a contact shoe having a contact is slid along a moving passage on a base 11, and the contact part of the contact shoe makes contact with fixed contacts 13d, 13e, 14e, 14f provided on the moving passage, whereby position detection is carried out, recessed parts 13f, 13g, 14g having the form corresponding to the contact part of the contact shoe are provided on the moving passage.

    Molded component, electric equipment and method for manufacturing molded component
    8.
    发明专利
    Molded component, electric equipment and method for manufacturing molded component 有权
    模制部件，电气设备和制造模制部件的方法

    公开(公告)号：JP2013067177A

    公开(公告)日：2013-04-18

    申请号：JP2013001810

    申请日：2013-01-09

    Applicant: Sony Corp ,  ソニー株式会社

    Inventor： KOBAYASHI FUJIO ,  TORIMOTO MASASHI ,  ARAI SHIZUO ,  KAJIKAWA KATSUJI

    IPC: B29C45/16 ,  B29C45/14 ,  B29C45/26 ,  B29L9/00 ,  H05K5/03

    Abstract: PROBLEM TO BE SOLVED: To provide a molded component has excellent molding quality and durability, electric equipment manufactured using the molded component as a housing, and a method for manufacturing the molded component.SOLUTION: The molded component includes a primary molding layer, a secondary molding layer and an in-mold layer. The primary molding layer includes a base part and a protrusion part. The base part is entirely box-shaped. The protrusion part protrudes from a circumferential edge of the base part. The secondary molding layer is laminated on the primary molding layer and made of a light-permeation resin material. The in-mold layer is formed between the primary molding layer and the secondary molding layer.

    Abstract translation: 要解决的问题：为了提供具有优异的成型质量和耐久性的模制部件，使用模制部件作为壳体制造的电气设备以及用于制造模制部件的方法。 解决方案：模制部件包括初级模制层，次模塑层和模内层。 初级成型层包括基部和突出部。 基座完全是盒形的。 突起部从基部的周缘突出。 第二成型层层叠在初级成型层上，由透光性树脂材料构成。 模内层形成在初级模塑层和次模塑层之间。 版权所有（C）2013，JPO＆INPIT

    Molded part, electronic device, and method of producing molded part
    9.
    发明专利
    Molded part, electronic device, and method of producing molded part 有权
    模制部件，电子设备及其制造方法

    公开(公告)号：JP2010120206A

    公开(公告)日：2010-06-03

    申请号：JP2008294175

    申请日：2008-11-18

    Applicant: Sony Corp ,  ソニー株式会社

    Inventor： KOBAYASHI FUJIO ,  TORIMOTO MASASHI ,  ARAI SHIZUO ,  KAJIKAWA KATSUJI

    IPC: B29C45/14 ,  B29C45/16

    CPC classification number: B29C45/1671 ,  B29C45/14688 ,  B29C45/14811 ,  B29C45/14827 ,  B29K2705/00 ,  B29K2995/002 ,  Y10T428/24612 ,  Y10T428/24802

    Abstract: PROBLEM TO BE SOLVED: To provide a molded part excellent in molding quality and durability, an electronic device in which the molded part is used in a housing, and a method of producing the molded part. SOLUTION: The molded part is provided with a primary molded layer 31, secondary molded layer 32, and in mold layer 33. The primary molded layer 31 has a base portion 310 and pedestal portion 320. The base portion 310 has a width direction in a first direction (direction of X-axis), length direction in a second direction ( direction of Y-axis), and height direction in a third direction (direction of Z-axis), respectively. The base portion 310 is a box shape as a whole. The pedestal portion 320 is projected toward outside from a periphery of the base portion 310. The secondary molded layer 32 is laminated on the primary molded layer 31, and is made of a light transmissive resin material which has width and length equivalent to the primary molded layer 31. The in mold layer 33 is formed between the primary molded layer 31 and secondary molded layer 32. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供成型品质和耐久性优异的模制部件，其中模制部件用于壳体中的电子装置以及制造模制部件的方法。 解决方案：模制部件设置有初始模制层31，二次模塑层32和模制层33.初级模制层31具有基部310和基座部分320.基部310具有宽度 方向（X轴方向），第二方向（Y轴方向）的长度方向以及第三方向（Z轴方向）的高度方向。 基部310整体上是箱形。 底座部分320从基部310的周边向外侧突出。二次模塑层32层叠在初级模制层31上，并且由具有与初级模制件的宽度和长度相等的透光树脂材料制成 在第一模塑层31和第二模塑层32之间形成模内层33。版权所有（C）2010，JPO＆INPIT

    SEMICONDUCTOR SEALING METALLIC MOLD DIE AND SEMICONDUCTOR SEALING DEVICE HAVING THIS MOLD DIE AND SEMICONDUCTOR DEVICE RESIN SEALING METHOD
    10.
    发明专利
    SEMICONDUCTOR SEALING METALLIC MOLD DIE AND SEMICONDUCTOR SEALING DEVICE HAVING THIS MOLD DIE AND SEMICONDUCTOR DEVICE RESIN SEALING METHOD 失效

    公开(公告)号：JPH09186183A

    公开(公告)日：1997-07-15

    申请号：JP35261195

    申请日：1995-12-29

    Applicant: SONY CORP

    Inventor： KOBAYASHI FUJIO ,  TAWARA MASAKAZU

    IPC: B29C45/26 ,  B29C45/02 ,  B29C45/14 ,  B29K105/20 ,  B29L31/34 ,  H01L21/56

    Abstract: PROBLEM TO BE SOLVED: To mold a lead frame assembly efficiently suppressing the generation of burs by using a small-sized semiconductor-sealing metallic mold die. SOLUTION: A lead frame assembly 7 is molded with a mold die 20, by outsertion-molding resin 5 for sealing a semiconductor chip 2 mounted on a lead frame 10 having a cull section 17 and a runner section 18 formed on the same surface. The mold die 20 has upper and lower mold members 22, 21, and is provided with a material resin supply mechanism 29 for supplying material resin 8 to the cavity, an ejecting mechanism 32 for ejecting the molded lead frame assembly 7, and a mold tightening mechanism for tightening and self-holding the upper and lower mold members 22, 21. This mold 20 is carried and circulated intermittently at every molding process, in a molding device. In the molding device, drive mechanisms for the material resin supply mechanism and the ejecting mechanism, and a heating mechanism for the mold 20 are provided.

Patent Agency Ranking