-
公开(公告)号：JPH11233227A
公开(公告)日：1999-08-27
申请号：JP3522398
申请日：1998-02-17
Applicant: SONY CORP
Inventor： TAWARA MASAKAZU , OMORI HIDEO
IPC: H01R11/12 , H01R43/048
Abstract: PROBLEM TO BE SOLVED: To provide a method and a structure of jointing a terminal with a lead improving jointing strength of the terminal with the lead. SOLUTION: A connector part 14 of a terminal 10 is embossed with an umbo 15, an aperture 16a is formed in the tip part of a lead 16, the aperture 16a is locked onto the umbo 15 to caulk it, thus the terminal 10 is jointed with the lead 16. Consequently, jointing strength of the terminal 10 with the lead 16 can be improved.
-
公开(公告)号：JPS63112134A
公开(公告)日：1988-05-17
申请号：JP25991186
申请日：1986-10-31
Applicant: SONY CORP
Inventor： KOTAKI EIJI , TAWARA MASAKAZU
Abstract: PURPOSE:To prevent the collapse at the abutting surface between a tilting pin and a bottom force from developing by a method wherein the tilting pin is biased by a bias member in the direction that the tip inner side surface of the tilting pin is dealt in flush with the abutting surface of a movable retainer plate or of a liner. CONSTITUTION:When an ejector plate 11 is lowered during the mold closing action, a tilting pin 8 in the titled state is pulled in a bottom force 5. During pulling-in action of the tilting pin, when the inclined stepped part 14 on the outer side surface of the tilting pin 8 passes a roller 20, the tilting pin 8 is moved into the upright direction by the pressing force of a spring plunger 16, resulting in dealing the tip inner side surface 8b1 of the tilting pin in flush with the tip outer side surface 5a of the bottom force 5. The tilting pin 8 is smoothly pulled in the bottom force 5 without striking the edge part 5b of the abutting surface of the bottom force 5. In the state that the ejector plate 11 is fully lowered, the tip inner side surface 8b1 abuts against the tip outer side surface 5a in the state of being in closely contact with each other so as to allow to close a top force 4 and the bottom force 5. At mold closing, the tilting pin 8 is pulled in the bottom force 5 without striking the edge part 5b of the bottom force 5. Accordingly, no collapse develops at said edge part 5b.
-
公开(公告)号：JP2001047459A
公开(公告)日：2001-02-20
申请号：JP22694699
申请日：1999-08-10
Applicant: SONY CORP
Inventor： TAWARA MASAKAZU , EBARA TOSHIYUKI , HATAKAWA KAZUHIKO , ITO SADAYUKI
Abstract: PROBLEM TO BE SOLVED: To apply the low pressure and low mold clamping operation and shorten the molding time, make voids hard to be generated, control the amount of use of a sealing resin and deal with the thickness of a material to be molded and the variation of the sealing resin. SOLUTION: A resin injection hole 81 for a pot 15 is opened directly on a central section of a cavity face 71 of a cavity 7 of a bottom force 122 constituting a mold 12 in a resin sealing device. A plunger 16 for injecting a resin melted in the pot 15 from the side opposite to the side of the resin injection hole 81 into the cavity 7 is fitted slidably while being in the airtight state with the inner wall of the pot 15. Also a cushioning means 283 is incorporated into the plunger 16.
-
4.发明专利
公开(公告)号：JPH09153581A
公开(公告)日：1997-06-10
申请号：JP31334395
申请日：1995-11-30
Applicant: SONY CORP
Inventor： KOBAYASHI FUJIO , TAWARA MASAKAZU
Abstract: PROBLEM TO BE SOLVED: To eliminate burrs so as to rationalize the process, downsize a sealing device and reduce the cost and the amount of resin material. SOLUTION: A lead frame 10, which is integrally formed by using conductive metal thin board as material, is provided. On the lead frame 10, a chip mounting part 11 whereupon a semiconductor chip 2 is to be mounted, many punched out lead terminal pieces, a resin supply part 17 and a runner part 18 are formed. On the lead frame 10, sealing resin 5 which seals the semiconductor chip 2 by exposing the leading edge of each lead terminal piece is outsert-molded. The resin supply part 17 is formed within the same plane as the resin filling area 13 of resin material, and a part of the runner part is prevented from crossing the lead frame 10.
-
公开(公告)号：JPH08227964A
公开(公告)日：1996-09-03
申请号：JP5649495
申请日：1995-02-21
Applicant: SONY CORP
Inventor： KOBAYASHI FUJIO , TAWARA MASAKAZU
Abstract: PURPOSE: To realize high mounting while realizing compactness by enlarging a lead pitch interval at a solder land part by providing a lead pattern which extends radially around a die pad arranged in a central part of a conductive disc member. CONSTITUTION: A circular lead frame wherein a lead is extended radially from a die pad at a central part is completed by punching a lead frame element material 9 formed to prepare one IC package to one lead frame by a press. Then, a semiconductor chip 5 is die-bonded to the lead frame 10. After a gold line 7 is wire-bonded, it is formed by molding by using resin 8. Then, resin burr 11 between leads 6 is removed by a process in a press die, a die bar 12 and an outer circumferential ring 13 are pulled down, lead bending processing is performed for the lead 6 by a punch and a die of a circular die set and a semiconductor integrated circuit is completed.
-
Patent Agency Ranking
公开(公告)号：JP2011218661A
公开(公告)日：2011-11-04
申请号：JP2010090056
申请日：2010-04-09
Inventor： KOMARU KIKUO , TAWARA MASAKAZU
Abstract: PROBLEM TO BE SOLVED: To provide a molding capable of retaining transfer foil surely on a molding layer and preventing damage to the decorative or conductive layer of the transfer foil, an electronic device and a method of manufacturing a molding.SOLUTION: In the molding, a part of in-mold foil 30 is sandwiched between a primary molding layer 10 and a secondary molding layer 20. Thus, the in-mold foil 30 between the primary molding layer 10 and the secondary molding layer 20 can be held. A decorative layer and a terminal electrode layer are arranged between the primary molding layer 10 and the secondary molding layer 20. Thus, the configuration prevents damage to the decorative layer and the terminal electrode layer, and the disturbance of the electric conduction of the terminal electrode layer caused by the adhesion of dust or the like.
Abstract translation: 要解决的问题：提供一种能够将转印箔确保地保持在成型层上并防止损坏转印箔的装饰或导电层的模制品，电子装置和制造模制品的方法。 解决方案：在模制中，模内箔30的一部分夹在初级模塑层10和次模塑层20之间。因此，在第一模塑层10和第二模塑层10之间的模内箔30 层20可以被保持。 在第一成型层10和第二成型层20之间设置有装饰层和端子电极层。因此，能够防止装饰层和端子电极层的损坏，以及端子电极的导电的干扰 由灰尘等的附着引起的层。 版权所有（C）2012，JPO＆INPIT
-
公开(公告)号：JPH11320617A
公开(公告)日：1999-11-24
申请号：JP13347598
申请日：1998-05-15
Applicant: SONY CORP
Inventor： YANAI MINORU , TAWARA MASAKAZU
Abstract: PROBLEM TO BE SOLVED: To provide a mold for molding by which molding of fine parts can be highly precisely performed and a method for molding using the mold. SOLUTION: A fixed mold 110 and a passage 121 for passing a molding raw material when it is filled under pressure are provided and a movable mold 120 which can be tightly stuck and separated to a fixed mold 110 is provided. In addition, a transfer mold 114 which is transferrably arranged in the fixed mold 110 by the pushing pressure of the above described molding raw material filled under pressure and forms a space with approximately the same shape as the outer shape of the above described molded body between the fixed mold 110 and a movable mold 114 after transferring is provided. In addition, a projected mold 115 which is fixed on the fixed mold 110 and is arranged in a through- hole 114a provided in the transfer mold 114 and is stored in the above described through-hole before the transfer mold is transferred and is projected into the above described space after it is transferred, is provided.
-
公开(公告)号：JP2002289717A
公开(公告)日：2002-10-04
申请号：JP2001088807
申请日：2001-03-26
Applicant: SONY CORP
Inventor： TAWARA MASAKAZU , HATAKAWA KAZUHIKO
Abstract: PROBLEM TO BE SOLVED: To obtain an electronic component apparatus sealed with a hollow package superior in moisture resistance. SOLUTION: A solid-state image pickup apparatus 30 that is one of electronic component apparatuses of the present invention has a structure where a package 31 is formed by a method wherein a lead frame coated with thermosetting resin at the prescribed position of the inner side of a lead is mounted in an injection molding die 20, melting thermoplastic resin is injected into its gate 24, and the thermosetting resin is melted at the temperature and interposed at an interface between the lead 12 and the thermoplastic resin to be bonded each other, and the hollow part 32 on which a CCD image chip 3 is mounted and fixed, after having wire bonded each electrode with wire 33 to an inner lead 121 of each lead 12, is sealed with a cover 34 made of transparent glass.
-
公开(公告)号：JPH09186183A
公开(公告)日：1997-07-15
申请号：JP35261195
申请日：1995-12-29
Applicant: SONY CORP
Inventor： KOBAYASHI FUJIO , TAWARA MASAKAZU
Abstract: PROBLEM TO BE SOLVED: To mold a lead frame assembly efficiently suppressing the generation of burs by using a small-sized semiconductor-sealing metallic mold die. SOLUTION: A lead frame assembly 7 is molded with a mold die 20, by outsertion-molding resin 5 for sealing a semiconductor chip 2 mounted on a lead frame 10 having a cull section 17 and a runner section 18 formed on the same surface. The mold die 20 has upper and lower mold members 22, 21, and is provided with a material resin supply mechanism 29 for supplying material resin 8 to the cavity, an ejecting mechanism 32 for ejecting the molded lead frame assembly 7, and a mold tightening mechanism for tightening and self-holding the upper and lower mold members 22, 21. This mold 20 is carried and circulated intermittently at every molding process, in a molding device. In the molding device, drive mechanisms for the material resin supply mechanism and the ejecting mechanism, and a heating mechanism for the mold 20 are provided.
-
公开(公告)号：JP2513227B2
公开(公告)日：1996-07-03
申请号：JP10734887
申请日：1987-04-30
Applicant: SONY CORP
Inventor： TAWARA MASAKAZU , UCHIKI TOSHIO , NAKAMARU KAZUKI , SASAKI NOBUYOSHI
-
-
-
-
-
-
-
-
-
Search Results
17
records
(took 0.021 seconds)
