FLAME RETARDANT ADHESIVE COMPOSITION

    公开(公告)号:JPS5584379A

    公开(公告)日:1980-06-25

    申请号:JP15805378

    申请日:1978-12-20

    Applicant: SONY CORP

    Abstract: PURPOSE:To provide a flame retardant adhesive composition adapted for a flexible printed circuit board fabrication by containing bisphenol type brominated epoxy resin, acrylic compolymer obtained by copolymerizing specified starting materials, and specified acid anhydrides as main components. CONSTITUTION:100pts.wt. of brominated epoxy resin (A), 40-80pts.wt. of acrylic copolymer (B), and acid anhydride (C) represented by the formula I, wherein X is H or 1-4C hydrocarbon group, and Y is H, COOH, or 1-4C hydrocarbon group, are mixed as main components, and (B) is obtained by copolymerization of 5-35wt% of acrylonitrile (a), 0.5-10wt% of an ethylenically unsaturated compound (b) having one or more functional groups selected from COOH, OH and epoxy group, and an ester (C) obtained from 1-6C alcohol and acrylic acid and/or methacrylic acid substantially occupying the remaining part.

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