公开(公告)号：EP2456197A4

公开(公告)日：2013-07-17

申请号：EP10799776

申请日：2010-07-09

Applicant: SONY CORP

Inventor： YOSHIDA TOSHIKAZU ,  OZAWA HIDEAKI ,  IKEDA MITSURU ,  KURIHARA HIDETOSHI ,  YOSHIDA KOJI ,  SHIMANUKI MASARU ,  IMAI TADASHI

IPC: H04N5/46 ,  H04B1/08 ,  H04B1/10 ,  H04B1/16 ,  H04N5/44 ,  H04N7/173

CPC classification number: H04B1/18 ,  H04N5/455 ,  H04N5/46 ,  H04N21/40

公开(公告)号：JPS5173881A

公开(公告)日：1976-06-26

申请号：JP14788974

申请日：1974-12-23

Applicant: Sony Corp

Inventor： KOBAYASHI KOTAKE ,  OZAWA HIDEAKI

IPC: H01L29/73 ,  H01L21/205 ,  H01L21/331 ,  H01L29/08 ,  H01L29/32 ,  H01L29/36 ,  H01L29/47 ,  H01L29/78 ,  H01L29/872

公开(公告)号：JP2013038520A

公开(公告)日：2013-02-21

申请号：JP2011171343

申请日：2011-08-04

Applicant: Sony Corp ,  ソニー株式会社

Inventor： IMAI MASASHI ,  OZAWA HIDEAKI ,  NAGANO TOSHIYUKI ,  TOYODA AKIYUKI ,  NAKAJIMA TOMONORI ,  IGATA MITSURU ,  ARAKAWA TAKEHITO ,  SUDO TOSHIYUKI ,  UCHIDA NORIO ,  TAKAMATSU HIROYUKI

IPC: H04B1/08

CPC classification number: H04N5/50 ,  H04N21/426 ,  H04N21/4263

Abstract: PROBLEM TO BE SOLVED: To reduce the thickness dimension of the whole of a receiving device having a tuner module mounted therein to the thinnest possible.SOLUTION: A tuner module includes a tuner module board (hereafter the board) 210, a case body 220 which contains the board 210 therein, and an antenna connector which is fixed to the case body 220 (hereafter the connector) 230. On a bonded surface between the connector 230 and the case body 220, there are formed convex fixing parts 235a, b and a holding part 237. Also, the case body 220 has a horizontal and a vertical plane against at least the board 210, the vertical plane having one or more insertion holes 222 and 221a, b formed therein. When the core wire and fixing parts 235a, b of the connector 230 are inserted into the insertion holes 222 and 221a, b of the case body 220, a section on the vertical plane of the case body 220 from the insertion holes 222 and 221a, b to the horizontal plane is held in place by the fixing parts 235a, b of the connector 230 and the holding part 237.

Abstract translation: 要解决的问题：为了减少其中安装有调谐器模块的接收装置整体的厚度尺寸最小。 调谐器模块包括调谐器模块板（以下称为板）210，其中包含板210的壳体220和固定到壳体220（以下称为连接器）230的天线连接器。 在连接器230和壳体220之间的接合表面上形成有凸起的固定部分235a，b和保持部分237.此外，壳体主体220具有至少与板210相对的水平和垂直平面， 垂直平面，其中形成有一个或多个插入孔222和221a，b。 当连接器230的芯线和固定部分235a，b插入壳体220的插入孔222和221a，b时，从插入孔222和221a的壳体220的垂直平面上的部分， b通过连接器230和保持部件237的固定部分235a，b保持在适当的位置。（C）2013，JPO＆INPIT

公开(公告)号：JP2013030960A

公开(公告)日：2013-02-07

申请号：JP2011165295

申请日：2011-07-28

Applicant: Sony Corp ,  ソニー株式会社

Inventor： YOSHIDA TOSHIKAZU ,  OZAWA HIDEAKI

IPC: H04B1/18 ,  H04N5/44

CPC classification number: H04N5/50 ,  H03F3/195 ,  H03H7/24 ,  H03H7/48 ,  H05K1/0243 ,  H05K2201/09254

Abstract: PROBLEM TO BE SOLVED: To make signal levels for high-frequency signals input to each high-frequency processing circuit uniform, even if the distance from input terminals to each high-frequency processing circuit is not equal.SOLUTION: High-frequency signals are input to input terminals. A high-frequency amplifier 12 amplifies the high-frequency signals input to the input terminals. Distributors 13 distribute the high-frequency signals amplified by the high-frequency amplifier 12. A plurality of high-frequency processing circuits 15 each have different transmission path lengths up to where each high-frequency signal distributed by the distributors 13 is input to the signal input unit therefor. A plurality of attenuators 14 are provided in the stage preceding the plurality of high-frequency processing circuits 15. The shorter the transmission path length, a higher attenuation amount is set.

Abstract translation: 要解决的问题：为了使输入到每个高频处理电路的高频信号的信号电平均匀，即使从输入端到每个高频处理电路的距离不相等。

解决方案：高频信号输入到输入端子。 高频放大器12放大输入到输入端的高频信号。 分配器13分配由高频放大器12放大的高频信号。多个高频处理电路15各自具有不同的传输路径长度，直到由分配器13分配的每个高频信号被输入到信号 输入单元。 多个衰减器14设置在多个高频处理电路15之前的级中。传输路径长度越短，衰减量越大。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012028996A

公开(公告)日：2012-02-09

申请号：JP2010165131

申请日：2010-07-22

Applicant: Sony Corp ,  ソニー株式会社

Inventor： IMAI MASASHI ,  WATANABE AKIRA ,  SUDO TOSHIYUKI ,  NAGANO TOSHIYUKI ,  IGATA MITSURU ,  TOYODA AKIYUKI ,  OZAWA HIDEAKI ,  NAKAJIMA TOMONORI ,  ARAKAWA TAKEHITO ,  UCHIDA NORIO ,  TAKAMATSU HIROYUKI

IPC: H04N5/64 ,  H04B1/08

CPC classification number: H04N5/50 ,  H03J5/00 ,  H04N5/64 ,  H04N21/426

Abstract: PROBLEM TO BE SOLVED: To provide a tuner module and a receiver unit, which regulate the entire system thickness formed when a tuner module is mounted on a circuit board so as to be the same thickness as the tuner module and make the entire system extremely thin, which form the system at low cost.SOLUTION: A tuner module comprises: a tuner module substrate 11 in which a tuner function part is formed; a case body 13 having a shield function which holds at least the tuner module substrate 11 so as to incorporate the tuner module substrate 11; a circuit board 12 on which the tuner module substrate 11 is mounted; and an antenna connector 14 fixed to the case body 13 and having a core wire 141 connected with the tuner module substrate 11 incorporated into the case body 13. A part of the circuit board 12 is included in the interior of the case body 13.

Abstract translation: 要解决的问题：提供一种调谐器模块和接收器单元，其调节当调谐器模块安装在电路板上形成的整个系统厚度，以便与调谐器模块具有相同的厚度并使整个 系统极薄，以低成本形成系统。 调谐器模块包括：调谐器模块基板11，其中形成有调谐器功能部分; 具有至少保持调谐器模块基板11以便结合调谐器模块基板11的屏蔽功能的壳体13; 安装有调谐器模块基板11的电路板12; 以及天线连接器14，其固定到壳体13，并且具有与调谐器模块基板11连接的芯线141，该芯线141并入壳体13中。电路板12的一部分包括在壳体13的内部。 P>版权所有（C）2012，JPO＆INPIT