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公开(公告)号：JP2010027633A
公开(公告)日：2010-02-04
申请号：JP2008183383
申请日：2008-07-15
Inventor： TANAKA TORU , ISHIKAWA NATSUYA , ASAMI HIROSHI
IPC: H01L21/60
CPC classification number: H01L2224/11 , H01L2224/14 , H01L2224/1403 , H01L2224/14051 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To allow a composition measurement pattern, which is so sized as to be taken with a measurement by a fluorescent X-ray measuring instrument, to have the same composition with a solder bump. SOLUTION: A semiconductor device has the solder bump 20 formed on a substrate 10, and the composition measurement pattern 30 formed on the substrate 10 for measuring the composition of the solder bump 20, the composition measurement pattern 30 having the same volume with the solder bump 20 and larger surface area than the solder bump 20. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：为了允许通过荧光X射线测量仪测量尺寸的组合物测量图案具有与焊料凸块相同的组成。 解决方案：半导体器件具有形成在衬底10上的焊料凸块20，以及形成在用于测量焊料凸块20的组成的衬底10上的组成测量图案30，具有相同体积的组成测量图案30 焊料凸块20和比焊料凸块20更大的表面积。版权所有（C）2010，JPO＆INPIT
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2.发明专利
公开(公告)号：JP2004172292A
公开(公告)日：2004-06-17
申请号：JP2002335456
申请日：2002-11-19
Inventor： TANAKA TORU
CPC classification number: H01L24/81 , H01L2224/11 , H01L2224/1147 , H01L2224/13099 , H01L2224/81194 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component and a circuit board having solder bumps, high in productivity and in yield, and to provide a method for mounting the electronic component on the circuit board. SOLUTION: In this method for mounting an electronic component having solder bumps on a circuit board, a plurality of electrode pads 21 on a semiconductor chip S of the electronic component are selected at predetermined intervals, and solder bumps Ba are formed on the selected electrode pads 21a. On electrode lands Lb on a printed circuit board P to be mounted with the semiconductor chip S, solder bumps Bb are formed for the electrodes pads not selected at the preceding step. The semiconductor chip S is mounted face down at a prescribed position on the printed circuit board P, the solder bumps Ba and Bb on the two are heated and melted, and then cooled for the establishment of electrical connection between the semiconductor chip S and the printed circuit board P. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2002124532A
公开(公告)日：2002-04-26
申请号：JP2000316898
申请日：2000-10-17
Applicant: SONY CORP
Inventor： TANAKA TORU
IPC: H01L21/60
Abstract: PROBLEM TO BE SOLVED: To realize sure connection of a gold wire and a gold bump in a semiconductor chip having a copper pad. SOLUTION: This semiconductor device is provided with the copper pad 10 formed on a surface of the semiconductor chip 1, a film of solder 12 formed on a surface of the copper pad 10, and the gold wire which is electrically connected with the copper pad 10 via the film of the solder 12. This melted for manufacturing the semiconductor device is provided with a process for spreading flux 11 on a surface of the copper pad 10 formed on the semiconductor chip 1, a process wherein solvent of the flux 11 spread on the surface of the copper pad 10 is heated and vaporized and the surface of the copper pad 10 is coated with the film of the solder 12, and a process wherein the gold wire is fixed by pressure via the film of the solder 12 and is electrically connected with the copper pad 10.
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公开(公告)号：JP2002110714A
公开(公告)日：2002-04-12
申请号：JP2000302034
申请日：2000-10-02
Applicant: SONY CORP
Inventor： KANEMOTO AYUMI , TANAKA TORU , NISHIYAMA KAZUO
Abstract: PROBLEM TO BE SOLVED: To provide electronic equipment which enables packaging, reducing man-hours, such as a mount process, superior in reliability and easy at a low cost by utilizing the characteristic of wafer batch processing, dispensing with a mother board and the packaging using till now, and performing cutting after pseudo-wafers are collectively mounted in batch on a wiring board having the similar functions as this. SOLUTION: An adhesive sheet 2 is stuck on the board 1, a plurality of nondefective bare chips are fixed on the adhesive sheet 2 by setting the face of the A1 electrode pad 5 upside down, a resin 4 is adhered on the whole face including a part between the plurality of the good product bare chips 3, the pseudo-wafer 29 fixing the nondefective bare chips 3 are peeled, integrated with a pseudo mother board 80 providing corresponding wiring or the like, the resin 4 is cut between the nondefective bare chips 3 to separate each nondefective chip module 82, and electronic equipment is made, by using it.
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公开(公告)号：JP2000184052A
公开(公告)日：2000-06-30
申请号：JP35180898
申请日：1998-12-10
Applicant: SONY CORP
Inventor： TANAKA TORU
Abstract: PROBLEM TO BE SOLVED: To obtain an automatic answering telephone device realizing various kinds of functions such as recording a variable answering message, retaining recording contents even in the case of power interruption, realizing portability and low power consumption, realizing both of a good sound quality and long recording time. SOLUTION: In advance of an outside-line incoming call from a telephone circuit network, the automatic answering telephone device R is previously set in an automatic answering mode and a CPU 2 recognizes whether a recording medium 11 is connected to an M/S interface part 1 and operates to store information concerning this medium 11 in a RAM (incorporated memory) 3. In addition, a user selectively sets which to store a business message from an opposite party in the medium 11 or to store in the RAM (incorporated memory) 3. Thus, the erasure of the message content due to power off is prevented. In addition, a power source for power interruption is unnecessitated.
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Patent Agency Ranking
公开(公告)号：JP2000124591A
公开(公告)日：2000-04-28
申请号：JP29953698
申请日：1998-10-21
Applicant: SONY CORP
Inventor： TANAKA TORU
Abstract: PROBLEM TO BE SOLVED: To raise reliability in printing with a solder paste by printing a flux or solder paste of high adhesion using a printing mask, and then doing a solder paste of low viscosity using the printing mask. SOLUTION: A printing mask is made to contact on a substrate 20 comprising a semiconductor wafer, a solder paste 40 of high viscosity and adhesion is supplied on the upper surface of the printing mask, and a squeegee 25 is moved to roll a solder paste 40, so that a through hole of the printing mask is filled with the solder paste 40. Then the substrate 20 is separated from the printing mask, a printing mask 30 is made to contact the surface of the substrate 20, and a solder paste 32 of low viscosity is supplied on the upper surface of the mask 30. By moving a squeegee 33 to roll the solder paste 32, the solder paste 32 is packed in a through hole 31 corresponding to an electrode 21 of the printing mask 30.
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公开(公告)号：JPH03214486A
公开(公告)日：1991-09-19
申请号：JP909990
申请日：1990-01-18
Applicant: SONY CORP
Inventor： KAWABATA TOMOMIKI , TANAKA TORU , TANIGUCHI HITOSHI
IPC: G11B25/04
Abstract: PURPOSE:To reduce deterioration due to a noise by providing an auxiliary printed board equipped with a recording/reproducing amplifier, a reproducing side frequency characteristic circuit, and a pulse shaping circuit in a case, and connecting it to a magnetic head and a main printed board. CONSTITUTION:A flexible printed board (auxiliary printed board) 7 whose cross-section is bent in U-shape is provided at the corner part of a metallic case 1. The reproducing side pulse shaping circuit 10 is packaged on the lower plane of the upper side board part 7a of the board 7, and the recording/ reproducing amplifier 8 and the reproducing side frequency characteristic circuit 9 are packaged on the upper plane of a lower side board 7b. Thereby, since a reproducing signal is supplied to a rigid printed board 11 side after it is converted to a digital signal at the reproducing side pulse shaping circuit 10 on the board 7, the influence of an outside noise is hard to receive, and also, signal interference from a digital circuit to an analog circuit can be prevented receiving. Also, since the circuits 8, 9, and 10 are separated from the board 11, the design of the board 11 can be facilitated without considering the signal interference.
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公开(公告)号：JPH01320434A
公开(公告)日：1989-12-26
申请号：JP15287488
申请日：1988-06-21
Applicant: SONY CORP
Inventor： TANAKA TORU , OTA KEIICHI , OSATO MAMORU
Abstract: PURPOSE:To prevent the occurrence of an error to be caused by a temperature change and to attain a highly accurate detection by rotating a discoid scale together with an rocking arm after the scale is fitted to the outer periphery of the rocking central shaft. CONSTITUTION:A discoid scale 31 is provided, which is made of numerous slits 40 arranged radically to the center of a disk 39 formed in an annular shape at prescribed intervals in the circumferential direction of the disk 39, is fitted to the outer periphery of a rocking central shaft, such as an arm shaft, etc., and rotated together with an rocking member of a head arm, etc. The discoid scale 31 constituted in such way uniformly expands or contracts in all directions when a temperature change occurs. When, for example, the scale 31 expands, a slit detecting point A1 moves to a point A3 on the extension line in the lengthwise direction of the slit 40 of the scale 31 and the rotational angle of the head arm goes to a fixed angle theta1 even under a normal and high temperature conditions and no off-track of the head occurs. Thus occurrence of an error due to a change in temperature is prevented and highly accurate detection is made possible.
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公开(公告)号：JP2009289340A
公开(公告)日：2009-12-10
申请号：JP2008141176
申请日：2008-05-29
Inventor： TANAKA TORU
IPC: G11B7/09
Abstract: PROBLEM TO BE SOLVED: To improve dynamic skew performance to an objective lens, while realizing miniaturization more than in the conventional manner. SOLUTION: Even while a lens holder 50 is moved in a tracking direction or a focusing direction within a maximum movable range, the inclination of the objective lens LE in a radial direction due to the occurrence of undesired torque is reduced to improve dynamic skew performance by arranging rear coils 56L and 56R for focusing and rear coils 55L and 55R for tracking, in such a relative position relation in which they are prevented from intruding into a neighboring magnet's magnetic field area which is of NS reverse polarity which does not contribute to the occurrence of thrust of rear magnets 74L and 74R for focusing and a rear magnet 73 for tracking. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：为了提高物镜的动态偏移性能，同时比常规方式更多地实现小型化。
解决方案：即使透镜架50在最大可移动范围内沿跟踪方向或聚焦方向移动，由于发生不期望的转矩而导致的物镜LE在径向方向上的倾斜度减小以改善动态 通过布置用于聚焦的后线圈56L和56R和用于跟踪的后线圈55L和55R，以这样的相对位置关系来阻止它们被阻止进入不具有NS反向极性的相邻磁体的磁场区域 发生用于聚焦的后磁体74L和74R的推力和用于跟踪的后磁体73。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009140948A
公开(公告)日：2009-06-25
申请号：JP2007312325
申请日：2007-12-03
Inventor： MORIMOTO AKITA , TANAKA TORU , ASAMI HIROSHI , NABE YOSHIHIRO
CPC classification number: H01L24/94 , H01L2924/15788 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a CMOS type solid-state semiconductor imaging apparatus and a manufacturing method thereof, in which airtight sealing using a metal seal is extremely easily carried out without reducing the manufacturing yield. SOLUTION: The CMOS type solid-state semiconductor imaging apparatus 1 has a CMOS type solid-state imaging element 2 and a glass substrate 6 disposed across a frame material 5 enclosing a photodetection area 3 of the CMOS type solid-state imaging device, wherein the frame member is composed of a first base metal layer 10 formed on the CMOS type solid-state imaging element 2, a second base metal layer 11 formed on the glass substrate 6, and a connection metal layer 12 connecting the first base metal layer and second base metal layer to each other. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种CMOS型固态半导体成像装置及其制造方法，其中使用金属密封件的气密密封极其容易地进行而不降低制造成品率。 解决方案：CMOS型固态半导体成像装置1具有CMOS型固态成像元件2和玻璃基板6，玻璃基板6设置在包围CMOS型固体摄像元件的光检测区域3的框架材料5的两侧 其中，所述框架构件由形成在所述CMOS型固体摄像元件2上的第一基底金属层10，形成在所述玻璃基板6上的第二基底金属层11和连接所述第一基底金属 层和第二基底金属层彼此。 版权所有（C）2009，JPO＆INPIT
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