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    BASE PLATE FIXING APPARATUS OF SCREEN PRINTING MACHINE
    3.
    发明专利
    BASE PLATE FIXING APPARATUS OF SCREEN PRINTING MACHINE 失效

    公开(公告)号：JPH01209136A

    公开(公告)日：1989-08-22

    申请号：JP3293488

    申请日：1988-02-17

    Applicant: SONY CORP

    Inventor： TOYAMA TOSHIO ,  TANAKA TADAMASA

    IPC: B41F15/26 ,  B23K3/06 ,  B41F15/20 ,  H05K3/12 ,  H05K3/34

    Abstract: PURPOSE:To enhance the quality of a cream solder printing process by preventing the generation of soldering inferiority, by providing an open air in-take port between the base plate receiving stand having a suction port and suction force generating source of a screen printing machine through a manual valve. CONSTITUTION:A suction force generating source 1 (vacuum pump) and a base plate receiving stand 5 are connected by a metal pipe, and a solenoid valve 2 for sucking and releasing a base plate 9 and a filter 3 for preventing the unnecessary substance such as cream solder sucked from the base plate receiving stand 5 from being sucked into the pump 1 are provided to said pipe. A branch 4 is provided between the filter 3 and the base plate receiving stand 5 and a manual valve 6 is provided to one end of the branch 4 while an open air in-take port 7 is provided to the leading end of the manual valve 6. Since the pump 1 sucks air from both of the open air in-take port 7 and the suction port 8 of the base plate receiving stand 5, the air suction ratio of the open air in-take port 7 and the suction port 8 is changed by regulating the manual valve 6 and the suction port 8 is changed by regulating the manual valve 6 and the suction amount of air from the suction port 8 can be simply regulated. Since the amount of the air sucked from the suction port 8 can be regulated, the turning of cream solder 13 to the gap between a screen 11 and the base plate 9 can be prevented at the time of printing of the cream solder 13.

    REFLOWING SOLDERING DEVICE
    4.
    发明专利
    REFLOWING SOLDERING DEVICE 失效

    公开(公告)号：JPS6284870A

    公开(公告)日：1987-04-18

    申请号：JP22637585

    申请日：1985-10-11

    Applicant: SONY CORP

    Inventor： TOYAMA TOSHIO ,  KATO KAZUYA ,  TANAKA TADAMASA ,  YAJIMA MASARU ,  HAYASAKA HARUTAKA ,  ARAI TORU ,  TERADA HITOSHI

    IPC: H05K3/34 ,  B23K1/012 ,  B23K3/04

    Abstract: PURPOSE:To cope with the deflection and deformation of a substrate by providing the hot blasting part having numerous hot blasting holes and by reflowing a creamy solder by locating the substrate on which the creamy solder coating component is arranged at the hot blasting hole part. CONSTITUTION:Numerous hot blasting holes 13... are provided at the prescribed part of the upper plate 7 of a hot blasting box 2 in a hot blasting part 1. The substrate 26 pinched between the arm 25 of a transfer means 16 is moved onto the hot blasting box 2 by inserting the substrate 26 on which the component coated with the creamy solder is arranged into the groove 12 of a guide rail 11. In this case, the creamy solder coated on the substrate 26 is reflowed by the hot blast blown out of the blowout hole 13.... The necessary reflowing soldering can thus be performed irrespective of the slight deflection and deformation of the substrate.

    METHOD OF MOUNTING PARTS
    5.
    发明专利
    METHOD OF MOUNTING PARTS 失效

    公开(公告)号：JP2002176252A

    公开(公告)日：2002-06-21

    申请号：JP2000374597

    申请日：2000-12-08

    Applicant: SONY CORP

    Inventor： SHIMADA MINORU ,  OTSU SHINICHI ,  NAKANO MASAHIRO ,  TOYAMA TOSHIO ,  INOUE MITSUO ,  INOUE KAZUYA

    IPC: H05K3/34

    Abstract: PROBLEM TO BE SOLVED: To lessen the carriage time in the mounting of parts on a double-sided wiring board, and also to lessen the loss of carriage time. SOLUTION: In a method of mounting parts on a double-sided wiring board where parts are to be mounted on both sides of front and rear or an aggregate wiring board where a plurality of double-sided wiring boards are collected, a cream solder printing process 11 or a part attachment process 12 is performed in the condition that two sheets of these double-sided wiring boards or aggregate wiring boards are coupled with the front and rear surfaces connected with each other by couplings means 21 and 23.

    Soldering device
    6.
    发明专利
    Soldering device 失效
    焊接设备

    公开(公告)号：JPH11274708A

    公开(公告)日：1999-10-08

    申请号：JP7940898

    申请日：1998-03-26

    Applicant: Sony Corp ,  ソニー株式会社

    Inventor： TOMIZUKA KENICHI ,  TOYAMA TOSHIO

    IPC: H05K3/34

    Abstract: PROBLEM TO BE SOLVED: To obtain a soldering device which applies an appropriate amount of solder in accordance with a solder joint size so as to form a solder joint having high joint strength.
    SOLUTION: A soldering device 10 is a wave soldering machine, in which an electronic part is installed on a mounted substrate above a solder jet chamber 18 in accordance with a wave soldering method while a substrate transporting conveyer 12 holds and transports the mounted substrate and the electronic part. In the soldering machine 10, the substrate transporting conveyer shifts the mounted substrate above the solder jet chamber 18 in a state in which a substrate surface of the mounded substrate is inclined downward at a depression angle of +0°-7° relative to a horizontal line of the transporting direction, while a solder jet nozzle sprays solder jet onto the substrate surface of the mounted substrate. Consequently, a solder layer is deposited to the substrate surface.
    COPYRIGHT: (C)1999,JPO

    Abstract translation: 要解决的问题：获得根据焊点尺寸施加适量焊料的焊接装置，以形成具有高接合强度的焊点。 解决方案：焊接装置10是波峰焊机，其中电子部件根据波峰焊法安装在焊料喷射室18上方的安装基板上，同时基板输送输送机12保持并输送安装的基板和 电子部分。 在焊接机10中，基板输送输送机在被焊接的基板的基板表面以+ 0度-7度的倾斜向下倾斜的状态下将安装的基板移动到焊料喷射室18的上方。 相对于输送方向的水平线，而焊料喷射喷嘴将焊料喷射喷射到安装的基板的基板表面上。 因此，焊料层沉积到衬底表面。

    SCREEN FRAME FIXING DEVICE IN SCREEN PRINTING MACHINE
    9.
    发明专利
    SCREEN FRAME FIXING DEVICE IN SCREEN PRINTING MACHINE 失效

    公开(公告)号：JPH01229630A

    公开(公告)日：1989-09-13

    申请号：JP5799888

    申请日：1988-03-11

    Applicant: SONY CORP

    Inventor： TOYAMA TOSHIO ,  TANAKA TADAMASA

    IPC: B41F15/36 ,  B23K3/06 ,  H05K3/34

    Abstract: PURPOSE:To enable a screen frame to be fixed correctly and surely without paying attention, by holding the screen frame between rods of cylinder devices and stoppers after the positional regulation action of the cylinder devices. CONSTITUTION:A substrate 8 on a pair of chains 7, 7 is carried from a carry-in position to a discharge position through a previous printing position. A screen receive part 12 is fixed on the upper surface of a plurality of struts 11 raised on the upper surface of a device body 2. A screen frame 18 is disposed on a reference plane 13 (an upper surface) of the screen receive part 12. On the other hand, pressing means 21 consisting of stoppers 19a-19c disposed orthogonally and cylinder devices 20a-20c are provided by three sets so as to press the screen frame 18 orthogonally. Rods 25 of the three cylinder devices 20a-20c travel in the order of a non-pressing position, a pressing position, and the non-pressing position for conducting a positional regulation. Then, the screen frame 18 is subjected to a sufficient pressing force to be abutted against the stoppers 19a, 19b, and 19c, thereby being positioned accurately and surely.

    SCREEN PRINTING MACHINE
    10.
    发明专利
    SCREEN PRINTING MACHINE 失效

    公开(公告)号：JPH01229628A

    公开(公告)日：1989-09-13

    申请号：JP5799988

    申请日：1988-03-11

    Applicant: SONY CORP

    Inventor： TOYAMA TOSHIO ,  TANAKA TADAMASA

    IPC: B41F15/08 ,  B41F15/26 ,  H05K3/34

    Abstract: PURPOSE:To position a substrate correctly and ensure the attraction of the substrate to a substrate receive mount, by providing temporary substrate support mechanisms which press the upper surface of the substrate for supporting it when the substrate is positioned and attracted. CONSTITUTION:A substrate 8 on a pair of chains 7, 7 is carried from a carry-in position to a discharge position through a previous printing position. Temporary substrate support mechanisms 71 are disposed by four sets in total on two positions opposed to a pair of chain support blocks 3, 3. Arm parts 77 of the temporary support mechanisms 71 can move between a pressing position pressing the upper surface of the substrate 8 on the previous printing position and a releasing position permitting the raising or lowering. A reference pin 53 is raised by a substrate positioning means 45 on the previous printing position to be inserted into a reference hole of the substrate 8. Then, the substrate 8 is attracted in the state of being positioned to be held on the upper surface of a substrate receive mount 63. The substrate 8 pressed down by the arms 77 is horizontally displaced by the pressing force of the reference pin 53 if being offset from a correct position without the possibility of being levitated or further separated from the substrate receive mount 63.

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