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公开(公告)号：WO1994018003A1
公开(公告)日：1994-08-18
申请号：PCT/US1994001320
申请日：1994-02-04
Applicant: SOUTHWALL TECHNOLOGIES INC.
IPC: B32B31/00
CPC classification number: C23C14/205 , C23C14/024 , H05K1/0313 , H05K3/388 , Y10S428/913 , Y10T428/12569 , Y10T428/1259 , Y10T428/12806 , Y10T428/12819 , Y10T428/12826 , Y10T428/12993 , Y10T428/31681 , Y10T428/31786
Abstract: The adhesion to plastic substrates (112) of thick layers of functional metals (116) having an oxide heat of formation that is greater than -40,000 calories/gram atom of metal, such as silver, copper, gold, and the like, is improved if a thin layer of a metal having an oxide heat of formation of less than -50,000 calories/gram atom of metal is present as an adhesion-promoting primer layer metal has a melting point greater than 1100 DEG C, it should be present as the metal or as a substoichiometric oxide. When the primer layer metal (114) has a melting point less than 1100 DEG C, it may be present as the metal, as a substoichiometric oxide, or as a full stoichiometric oxide. Processes for preparing these materials using sputter-depositing and reflectors incorporating these materials are also disclosed.
Abstract translation: 具有大于-40,000卡路里/克原子的金属如银，铜，金等的具有形成氧化物热的功能金属（116）的厚层的塑料基板（112）的粘合性得到改善 如果作为粘附促进底漆层金属具有小于-50,000卡路里/克原子金属的氧化物热的金属的薄层存在大于1100℃的熔点，则其应当以 金属或亚化学计量氧化物。 当底漆层金属（114）的熔点低于1100℃时，它可以作为金属，作为亚化学计量的氧化物存在，或作为完全化学计量的氧化物存在。 还公开了使用溅射沉积和掺入这些材料的反射器制备这些材料的方法。
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2.发明公开
公开(公告)号：EP0686093A1
公开(公告)日：1995-12-13
申请号：EP94908723.0
申请日：1994-02-04
Applicant: Southwall Technologies, Inc.
Inventor： GIBBONS, Kevin, P. , LAU, Louis, C. , WOODARD, Floyd, E.
CPC classification number: C23C14/205 , C23C14/024 , H05K1/0313 , H05K3/388 , Y10S428/913 , Y10T428/12569 , Y10T428/1259 , Y10T428/12806 , Y10T428/12819 , Y10T428/12826 , Y10T428/12993 , Y10T428/31681 , Y10T428/31786
Abstract: The adhesion to plastic substrates (112) of thick layers of functional metals (116) having an oxide heat of formation that is greater than -40,000 calories/gram atom of metal, such as silver, copper, gold, and the like, is improved if a thin layer of a metal having an oxide heat of formation of less than -50,000 calories/gram atom of metal is present as an adhesion-promoting primer layer metal has a melting point greater than 1100 °C, it should be present as the metal or as a substoichiometric oxide. When the primer layer metal (114) has a melting point less than 1100 °C, it may be present as the metal, as a substoichiometric oxide, or as a full stoichiometric oxide. Processes for preparing these materials using sputter-depositing and reflectors incorporating these materials are also disclosed.
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3.发明授权
公开(公告)号：EP0686093B1
公开(公告)日：2000-08-09
申请号：EP94908723.3
申请日：1994-02-04
Applicant: Southwall Technologies, Inc.
Inventor： GIBBONS, Kevin, P. , LAU, Louis, C. , WOODARD, Floyd, E.
CPC classification number: C23C14/205 , C23C14/024 , H05K1/0313 , H05K3/388 , Y10S428/913 , Y10T428/12569 , Y10T428/1259 , Y10T428/12806 , Y10T428/12819 , Y10T428/12826 , Y10T428/12993 , Y10T428/31681 , Y10T428/31786
Abstract: The adhesion to plastic substrates (112) of thick layers of functional metals (116) having an oxide heat of formation that is greater than -40,000 calories/gram atom of metal, such as silver, copper, gold, and the like, is improved if a thin layer of a metal having an oxide heat of formation of less than -50,000 calories/gram atom of metal is present as an adhesion-promoting primer layer metal has a melting point greater than 1100 DEG C, it should be present as the metal or as a substoichiometric oxide. When the primer layer metal (114) has a melting point less than 1100 DEG C, it may be present as the metal, as a substoichiometric oxide, or as a full stoichiometric oxide. Processes for preparing these materials using sputter-depositing and reflectors incorporating these materials are also disclosed.
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