-
Patent Agency Ranking
公开(公告)号：GB2486000A
公开(公告)日：2012-06-06
申请号：GB201020284
申请日：2010-11-30
Inventor： FINDLAY EWAN , CAMPBELL COLIN , RAMSEY GEMMA , SAUGIER ERIC
IPC: H03K17/945 , H01L25/16 , H01L31/173
Abstract: Arrangements variously including baffles, grooves, slots, reflectors and blackening are provided to reduce unwanted internal light propagation from the emitter to the detector in a single-package optical proximity detector. For example, an opaque baffle 16 may be provided between the emitter 2 and detector 4, the baffle also serving as a locating feature to ensure alignment of the lens module 8 with the lens module mount 14. The baffle may have a curved surface (37, figure 7). Alternatively or additionally, one or more channels (figures 8-12) or V shaped grooves (figures 4-6 and 8-10) may be formed in the lens module 8 to reduce or further reduce unwanted light propagation from emitter to detector. A set of curved reflectors (102, figure 13) may be provided between the emitter and detector. The surface of the lens module may be selectively blackened to absorb unwanted radiation. The detector may be a SPAD and the proximity detector may be used in a mobile phone to disable the display and/or the phone controls when a user is deemed to be close and therefore making a call.
-
公开(公告)号：FR3078855A1
公开(公告)日：2019-09-13
申请号：FR1852018
申请日：2018-03-08
Inventor： SAXOD KARINE , MASTROMAURO NICOLAS , CAMPBELL COLIN
IPC: H05K5/03
Abstract: Capot d'encapsulation pour boîtier électronique et procédé de fabrication, dans lesquels une paroi frontale (3) d'un corps de capot (2) présente, autour d'un passage traversant (4), une face de montage (6) qui comprend une surface d'appui (7) sur laquelle une face de montage (8) d'un élément optique (5) prend appui et qui comprend au moins un évidement local (9) qui est en retrait par rapport à ladite surface d'appui (7) et qui aménage un espace (11) entre la face de montage de l'élément optique et le fond de l'évidement local et s'étendant au-delà d'un bord de l'élément optique, et dans lesquels une goutte de colle de fixation (16) s'étend localement dans ledit évidement local (9) et présente une portion (16a) couverte par l'élément optique et une portion (16b) découverte située au-delà dudit bord de l'élément optique.
-
公开(公告)号：GB2485998A
公开(公告)日：2012-06-06
申请号：GB201020281
申请日：2010-11-30
Applicant: ST MICROELECTRONICS RES & DEV
Inventor： CAMPBELL COLIN , FINDLAY EWAN
IPC: H03K17/945 , H01L25/16 , H01L31/173
Abstract: A single-package optical proximity detector with an internal light baffle. The sensitivity of an integrated optical proximity detector is improved at low cost by bending upwards a portion 40 of an attachment pad 8 during stamping of the lead frame, thus forming an internal light baffle to reduce internal propagation of radiation between the emitter 2 and the detector 4. Internal propagation may be further reduced by a groove 44 formed in the surface of the transparent moulding, the surfaces 48 and 50 being respectively perpendicular and parallel to rays emanating from the emitter 2. The location of the detector and emitter within a single unit permits close control of the emitter by circuits packaged within the detector. The detector 4 may comprise an array of photodiodes operating as SPADs or in photoconductive mode. Collimating Fresnel lenses (13, figure 1) may be formed in the surface of the moulding. Proximity of an object may be determined by time of flight measurement or by phase-shift techniques (figure 8). The proximity sensor may be used in a mobile phone (20,41, figure 7).
-
公开(公告)号：GB2505675A
公开(公告)日：2014-03-12
申请号：GB201215930
申请日：2012-09-06
Applicant: ST MICROELECTRONICS PTE LTD , ST MICROELECTRONICS RES & DEV
Inventor： HERARD LAURENT , CAMPBELL COLIN
IPC: G01J1/04 , G01S17/02 , H03K17/945
Abstract: A sensor package includes a radiation source 102 and a radiation detector 104 provided on a substrate. A cover member is mounted on or affixed to the substrate over the source and detector. The cover member includes an opaque housing 206, a first transparent portion provided over the source, a second transparent portion 204 provided over the detector and a transparent plate or insert 202 at one or more of said transparent portions, the transparent plate having a perimeter portion bounded at both its upper and lower surfaces by the housing. An opaque protrusion 208 may be provided on the housing separating a region associated with the first transparent portion (and radiation source) from a region associated with the second transparent portion (and detector), the protrusion attached to a surface of the substrate. The transparent insert 202 may comprise a window and may provide a focusing or a collimation function. The package may comprise an ambient light sensor. The package may perform proximity sensing calculations.
-
公开(公告)号：GB2494479A
公开(公告)日：2013-03-13
申请号：GB201118009
申请日：2011-10-19
Applicant: ST MICROELECTRONICS RES & DEV
Inventor： CAMPBELL COLIN
Abstract: A radiation sensor 1 comprises a reference radiation detector 8; a returned radiation detector 12; an optical isolator 18; a radiation source 4; and a cover 14 provided over the radiation source 4, the cover 14 comprising at least one directing surface, wherein the radiation source 4 and at least one directing surface are together arranged to direct (e.g. reflect and /or scatter) a portion of radiation emitted by the radiation source 4 onto the reference radiation detector 8. The optical isolator, such as a gap 18, is configured to impede the propagation of radiation between the reference radiation detector 8 and the returned radiation detector 12. The radiation sensor 1 may include an additional ambient radiation detector 10 and be a combined proximity and ambient light sensor. A method of manufacturing a radiation sensor may comprise depositing adhesive on the radiation source 4 and providing a cover 14 over the radiation source.
-
-
-
-
Search Results
5
records
(took 0.035 seconds)
