公开(公告)号：DE69841557D1

公开(公告)日：2010-04-29

申请号：DE69841557

申请日：1998-06-02

Applicant: ST MICROELECTRONICS SA

Inventor： EXPOSITO JUAN ,  HERARD LAURENT ,  CIGADA ANDREA

IPC: H01L21/56 ,  H01L23/31

Abstract: The procedure involves forming a large number of groups of connection zones (104) on a common support substrate (102) by a matrix technique. These correspond to each of the fixing zones of the integrated circuit chips. A chip (103) is fixed on to each zone, and each chip is electrically connected to the associated electrical connection zones (104). This allows the formation of a flat assembly (111) of connected chip - substrate units. The procedure includes a second stage of placing this assembly (111) in a mould (112) and injecting a coating material (106) into the mould. This allows formation of a parallelepiped block (117) in a single operation. In a final stage the parallelepiped box (117) is cut through its thickness in order to form a semiconductor casing structure.

公开(公告)号：FR2820240B1

公开(公告)日：2004-07-16

申请号：FR0101096

申请日：2001-01-26

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE ,  HERARD LAURENT

IPC: H01L21/56 ,  H01L23/04 ,  H01L21/58

Abstract: A substrate, in particular, a multilayer substrate, includes a mounting and electrical-connection support, and a face for mounting at least one integrated circuit chip (IC chip). The substrate and the mounted IC chip are placed in an injection mold. The injection mold has two parts that surround the periphery of the substrate. One part of the injection mold defines a cavity for molding an encapsulation material thereby encapsulating the IC chip, and includes a face for bearing on the mounting face. At least one recess is provided in one part of the injection mold. The recess defines, above the mounting face, a slot for providing a vent for venting gases. The mounting face includes a region on which a metal outer layer is placed. The metal outer layer extends along the recess and on the bearing face on both sides of the recess.

公开(公告)号：FR2820240A1

公开(公告)日：2002-08-02

申请号：FR0101096

申请日：2001-01-26

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE ,  HERARD LAURENT

IPC: H01L21/56 ,  H01L23/04 ,  H01L21/58

Abstract: The invention concerns a substrate, in particular a multilayer substrate constituting a mounting and electrical connection support, having a mounting surface (2) for at least an integrated circuit chip (3) and capable of being placed, equipped with said chip, in an injection mould (8) having two parts enclosing between them the periphery of the substrate and one of which defines a cavity for moulding (15) a coating material to encapsulate said chip and has a support surface on said mounting surface wherein is provided at least a recess (16) defining, above said mounting surface, a slot (17) constituting a gas vent. Said mounting surface (2) has a zone whereon is provided an outer metal layer (6) arranged so as to extend along said recess (16) and on said support surface (12) on either side of said recess.