公开(公告)号：JP2000208721A

公开(公告)日：2000-07-28

申请号：JP2000006540

申请日：2000-01-14

Applicant: ST MICROELECTRONICS SRL

Inventor： PIO FEDERICO ,  PAOLA ZULIANI ,  LORENZO FURATIN

IPC: H01L27/04 ,  H01L21/822 ,  H01L23/00 ,  H01L23/58

Abstract: PROBLEM TO BE SOLVED: To prevent a COB(chip outline band) structure body from acting as an obstacle element, when the COB structure body is operated in an electromagnetic field. SOLUTION: This chip outline band (COB) structure body is used in a integrated circuit, which is integrated in a semiconductor chip having a first conductivity-type semiconductor substrate 1, and the substrate is biased to a common reference potential (GND) of the integrated circuit. The chip outline band structure body is provided with a substantially annular region 3 formed in the substrate 1 along its periphery, and at least annular conducting regions 40, 60 which is superposed on the annular region 3 and is in contact with the annular region 3. The region 3 is electrically connected with a point of the common reference potential (GND).