MODULAR INTEGRATED CIRCUIT
    1.
    发明专利

    公开(公告)号:JPH0750343A

    公开(公告)日:1995-02-21

    申请号:JP8961594

    申请日:1994-04-27

    Abstract: PURPOSE: To provide a total integrated-circuit architecture related to a module integrated circuit which is advantageous in manufacture of large scale integrated circuit for digital data processing. CONSTITUTION: This integrated circuit having a large number of functional modules (M0, M1) equivalent to each other, having vertically-aligned functional elements (FF 1 to FF 3, +/-), and paths (gnd, vdd bus 1 to bus 8, vrt 1 to vrt 2) for power supply, control and interconnection, which extend on a substrate at various voltage levels. Power connection paths (gnd, vdd) horizontally extend across the respective modulus, and control parts (vrt 1-2) vertically extend across the functional elements of the adjacent modules. The element interconnection path within one module is formed by a horizontal section and a vertical section, which is particularly advatageous in the occupied region and applicable to a CAD design system.

Patent Agency Ranking