公开(公告)号：ITUB20152089A1

公开(公告)日：2017-01-10

申请号：ITUB20152089

申请日：2015-07-10

Applicant: ST MICROELECTRONICS SRL ,  ST MICROELECTRONICS SRL

Inventor： MIRABELLA IGNAZIO BRUNO ,  PAPPALARDO SALVATORE ,  RIBELLINO CALOGERO ,  NICOLOSI ALESSANDRO

IPC: H03K19/003 ,  G11C11/412 ,  H03K3/0233 ,  H03K19/177

公开(公告)号：IT201700096772A1

公开(公告)日：2019-03-01

申请号：IT201700096772

申请日：2017-08-29

Applicant: ST MICROELECTRONICS SRL

Inventor： ALESSANDRO AGATINO ANTONINO ,  MIRABELLA IGNAZIO BRUNO

IPC: H03K3/037

公开(公告)号：IT201700100380A1

公开(公告)日：2019-03-07

申请号：IT201700100380

申请日：2017-09-07

Applicant: ST MICROELECTRONICS SRL

Inventor： MIRABELLA IGNAZIO BRUNO ,  ALESSANDRO AGATINO ANTONINO

IPC: H03K5/153

公开(公告)号：IT201600123267A1

公开(公告)日：2018-06-05

申请号：IT201600123267

申请日：2016-12-05

Applicant: ST MICROELECTRONICS SRL

Inventor： MIRABELLA IGNAZIO BRUNO ,  PULVIRENTI FRANCESCO ,  PAPPALARDO SALVATORE

IPC: H03K17/082 ,  H03K19/003

公开(公告)号：ITUB20155681A1

公开(公告)日：2017-05-18

申请号：ITUB20155681

申请日：2015-11-18

Applicant: ST MICROELECTRONICS SRL

Inventor： MIRABELLA IGNAZIO BRUNO

IPC: H01L23/24 ,  H01L23/552

Abstract: A radiation-hard electronic device including a package structure, a semiconductor chip in a cavity within the package structure, an integrated circuit in the semiconductor chip, and structures for protection from radiation for protecting the integrated circuit from ionizing radiation. The structures for protection from radiation include a protective layer of gel, which occupies at least in part the cavity and coats the semiconductor chip.