公开(公告)号：WO2015177311A1

公开(公告)日：2015-11-26

申请号：PCT/EP2015/061329

申请日：2015-05-21

Applicant: STAMFORD DEVICES LIMITED

Inventor： HOGAN, Brendan ,  XU, Hong

IPC: C25D1/08 ,  A61M15/00 ,  B05B17/00 ,  A61M11/00

CPC classification number: B05B1/02 ,  A61M11/005 ,  A61M15/0085 ,  A61M2207/00 ,  B05B17/0638 ,  B05B17/0653 ,  C25D1/08 ,  C25D7/04

Abstract: An aperture plate is manufactured by plating metal around a mask of resist columns (2) having a desired size, pitch, and profile, which yields a wafer about 60μιη thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal (3) overlies the top surfaces of the columns until the desired apertures (4) are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways (24) formed beneath the apertures (32), formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures (32).

Abstract translation: 通过在具有期望的尺寸，间距和轮廓的抗蚀剂柱（2）的掩模上镀覆金属来制造孔板，其产生约60μI厚度的晶片。 这大约是完全期望的目标孔板厚度。 继续进行电镀，使得金属（3）覆盖在柱的顶表面上，直到达到所需的孔（4）。 这只需要一个掩模/电镀周期来实现所需的板厚度。 此外，板具有形成在孔（32）下方的通道（24），其形成为该方法的组成部分，通过掩模材料去除。 这些适合于夹带离开孔（32）的雾化液滴。

公开(公告)号：EP3437872A1

公开(公告)日：2019-02-06

申请号：EP18189179.7

申请日：2011-12-23

Applicant: Stamford Devices Limited

Inventor： XU, Hong

IPC: B41J2/16 ,  B05B17/06 ,  C25D5/02 ,  C25D5/10

Abstract: In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

公开(公告)号：EP3146090B1

公开(公告)日：2018-03-28

申请号：EP15727907.6

申请日：2015-05-21

Applicant: STAMFORD DEVICES LIMITED

Inventor： HOGAN, Brendan ,  XU, Hong

IPC: C25D1/08 ,  A61M15/00 ,  B05B17/00 ,  A61M11/00 ,  B05B17/06

CPC classification number: B05B1/02 ,  A61M11/005 ,  A61M15/0085 ,  A61M2207/00 ,  B05B17/0638 ,  B05B17/0653 ,  C25D1/08 ,  C25D7/04

Abstract: An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

公开(公告)号：EP3146090A1

公开(公告)日：2017-03-29

申请号：EP15727907.6

申请日：2015-05-21

Applicant: STAMFORD DEVICES LIMITED

Inventor： HOGAN, Brendan ,  XU, Hong

IPC: C25D1/08 ,  A61M15/00 ,  B05B17/00 ,  A61M11/00

CPC classification number: B05B1/02 ,  A61M11/005 ,  A61M15/0085 ,  A61M2207/00 ,  B05B17/0638 ,  B05B17/0653 ,  C25D1/08 ,  C25D7/04

Abstract: An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

Abstract translation: 通过在具有所需尺寸，间距和轮廓的抗蚀剂柱的掩模周围电镀金属来制造孔板，其产生约60μm厚的晶片。 这大约是全部期望的目标孔板厚度。 继续电镀，使金属覆盖在柱的顶面上，直到达到所需的孔。 这只需要一个掩模/电镀循环来达到所需的板厚。 而且，通过去除掩模材料，该板具有形成在该孔下方的通道，该通道形成为该方法的组成部分。 这些适合夹带离开孔的雾化液滴。

公开(公告)号：EP2658719A1

公开(公告)日：2013-11-06

申请号：EP11817258.4

申请日：2011-12-23

Applicant: STAMFORD DEVICES LIMITED

Inventor： XU, Hong

IPC: B41J2/16 ,  B05B17/06 ,  C25D5/02 ,  C25D5/10

CPC classification number: C25D7/00 ,  B05B17/0646 ,  B41J2/162 ,  B41J2/1625 ,  B41J2/1629 ,  B41J2/1631 ,  C25D1/003 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/54 ,  C25D5/022 ,  C25D5/10 ,  C25D5/34 ,  C25D5/48 ,  C25D5/54

Abstract: In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

Abstract translation: 在一个实施例中，用于制造孔板的方法包括在衬底上沉积可释放种子层，在可释放种子层上方施加第一图案化光刻掩模，将第一图案化光刻掩模具有到所需孔径图案的负图案，电镀a 在可释放种子层的暴露部分上方并由第一掩模限定的第一材料，在第一材料上方施加第二光刻掩模，第二光刻掩模具有负图案到第一空腔，将第二材料电镀在第二材料的暴露部分之上 第一材料并由第二掩模限定，去除两个掩模，以及蚀刻可释放种子层以释放第一材料和第二材料。 第一和第二材料形成用于使液体雾化的孔板。 根据其他实施例描述其它孔板和制造孔板的方法。

公开(公告)号：EP3795361A1

公开(公告)日：2021-03-24

申请号：EP20205363.3

申请日：2011-12-23

Applicant: Stamford Devices Limited

Inventor： XU, Hong

IPC: B41J2/16 ,  B05B17/06 ,  C25D5/02 ,  C25D5/10

Abstract: In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

公开(公告)号：EP2658719B1

公开(公告)日：2018-08-29

申请号：EP11817258.4

申请日：2011-12-23

Applicant: STAMFORD DEVICES LIMITED

Inventor： XU, Hong

IPC: B41J2/16 ,  B05B17/06 ,  C25D5/02 ,  C25D5/10

CPC classification number: C25D7/00 ,  B05B17/0646 ,  B41J2/162 ,  B41J2/1625 ,  B41J2/1629 ,  B41J2/1631 ,  C25D1/003 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/54 ,  C25D5/022 ,  C25D5/10 ,  C25D5/34 ,  C25D5/48 ,  C25D5/54

Abstract: In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.