公开(公告)号：JPH0376146A

公开(公告)日：1991-04-02

申请号：JP14881790

申请日：1990-06-08

Applicant: STAMICARBON

Inventor： FUBERUTASU MARII KURETSUSENZU ,  FUREDERITSUKU ERUNSUTO NITSUKU ,  YOHANESU ARUBERUTO YOSEFUSU MA

IPC: H01L23/08 ,  C08G69/44 ,  H01L23/10 ,  H01L23/29

Abstract: PURPOSE: To obtain a package having an optimal mechanical characteristics in which the possibility of damaging a wire on a carrier is minimized at the time of molding the package by imparting a liquid crystal polymer in a polymer composition with a specified pressure-flow index. CONSTITUTION: The package has an opening for containing an integrated circuit composed of an encapsulating element imparted to a carrier (lead frame) which can be sealed by means of a sealer. The encapsulating element is imparted to a preliminarily formed metal strip serving as a carrier. The metal strip has thickness of several mm to the maximum and made of copper or an iron/ nickel alloy and has higher temperature resistance. Polymer in a polymer composition preferably comprises a unit having oxybenzoyl and biphenoxy and it is produced from terephthalic acid and/or isophthalic acid. That polymer has mean pressure-flow index (PFI) value of maximum 8.5g/10min. The PFI value is a measure of workability and measured under a constant pressure using a rheometer.