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    Vinyl halide resin, epoxy or alkyd resin, monoalkenyl and polyalkenyl monomer reinforced thermoplastic composition
    1.
    发明授权
    Vinyl halide resin, epoxy or alkyd resin, monoalkenyl and polyalkenyl monomer reinforced thermoplastic composition 失效
    卤化乙烯基树脂，环氧树脂或醇酸树脂，单链烯基和聚烯基单体增强的热塑性组合物

    公开(公告)号：US3305514A

    公开(公告)日：1967-02-21

    申请号：US34314664

    申请日：1964-02-06

    Applicant: STANDARD OIL CO

    Inventor： TIFFAN ARTHUR J ,  SHANK RAYMOND S

    IPC: C08F291/00 ,  C08F299/04 ,  C08L63/00 ,  C08L67/06

    CPC classification number: C08L63/00 ,  B29C70/12 ,  C08F291/00 ,  C08F299/0478 ,  C08K5/00 ,  C08K5/20 ,  C08K7/02 ,  C08K7/14 ,  C08L27/00 ,  C08L67/06 ,  C08L101/00 ,  C08L2666/04

    Abstract: A polymer composition comprises an intimate cohesive mixture of (A) a thermoplastic vinyl halide resin, (B) a thermosetting synthetic polymer, (C) a polymerizable polyalkenyl monomer, (D) a polymerizable monoalkenyl monomer and, optionally, (E) randomly dispersed reinforcing fibres, with the provisos that (i) from 7 to 70 parts by weight of component (A) and from 93 to 30 parts by weight of components (B), (C) and (D) are present per 100 parts of the sum of (A) + (B) + (C) + (D); (ii) up to 80 parts by weight of component (B), up to 80 parts by weight of component (C) and from 10 to 100 parts by weight of component (D) are present per 100 parts by weight of (B) + (C) + (D) and (iii) from 0 to 50 parts by weight of component (E) are present per 100 parts by weight of components (A)+(B)+(C)+(D)+(E). The preferred component (A) is a vinyl chloride homo- or co-polymer, the preferred component (B) is an epoxide resin or an unsaturated alkyd resin and the preferred component (C) is an allyl ester, acrylic ester of a polyhydric alcohol or an allyl phosphate or phosphonate. Component (E) is preferably glass fibres. Stabilizers, antioxidants, polymerization catalysts, fillers &c. may be added including epoxidized vegetable oils. The uncured composition may be formed into the desired shape and then cured.

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