公开(公告)号：US09595650B2

公开(公告)日：2017-03-14

申请号：US15147850

申请日：2016-05-05

Applicant: STARLITE LED INC.

Inventor： Pao Chen ,  Chung Chi Chang ,  Ming Chieh Huang

IPC: H01L33/62 ,  H01L33/64 ,  H01L33/48 ,  H01L33/00 ,  H01L21/48 ,  H01L23/498 ,  H01L33/58

CPC classification number: H01L33/64 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract translation: 提供了一种用于制造LED封装基座的方法，包括提供具有顶表面和底表面的金属芯基片，并在金属芯基片中形成两个第一沟槽。 第一沟槽从顶表面延伸到底表面。 该方法还包括用第一介电材料至少部分地填充第一沟槽以形成电介质隔离。 电介质隔离将金属芯基板分成三个金属芯部分。 两个金属芯部分可以被配置为用作LED封装电极。 该方法还包括施加第二电介质材料以覆盖第一电介质材料的至少一部分，以及在第二电介质材料上形成导电层以形成电路触点。 导电层包括第一导电材料。

公开(公告)号：US20150123161A1

公开(公告)日：2015-05-07

申请号：US14073643

申请日：2013-11-06

Applicant: Starlite LED Inc.

Inventor： Pao Chen ,  Chung Chi Chang ,  Min Jay Huang

IPC: H01L33/40

CPC classification number: H01L33/64 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface, The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract translation: 提供了一种用于制造LED封装基座的方法，包括提供具有顶表面和底表面的金属芯基片，并在金属芯基片中形成两个第一沟槽。 第一沟槽从顶表面延伸到底表面。该方法还包括用第一介电材料至少部分地填充在第一沟槽中以形成绝缘隔离。 电介质隔离将金属芯基板分成三个金属芯部分。 两个金属芯部分可以被配置为用作LED封装电极。 该方法还包括施加第二电介质材料以覆盖第一电介质材料的至少一部分，以及在第二电介质材料上形成导电层以形成电路触点。 导电层包括第一导电材料。

公开(公告)号：US09502628B2

公开(公告)日：2016-11-22

申请号：US14073643

申请日：2013-11-06

Applicant: Starlite LED Inc.

Inventor： Pao Chen ,  Chung Chi Chang ,  Ming Chieh Huang

IPC: H01L33/64 ,  H01L33/48 ,  H01L33/00

CPC classification number: H01L33/64 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract translation: 提供了一种用于制造LED封装基座的方法，包括提供具有顶表面和底表面的金属芯基片，并在金属芯基片中形成两个第一沟槽。 第一沟槽从顶表面延伸到底表面。 该方法还包括用第一介电材料至少部分地填充第一沟槽以形成电介质隔离。 电介质隔离将金属芯基板分成三个金属芯部分。 两个金属芯部分可以被配置为用作LED封装电极。 该方法还包括施加第二电介质材料以覆盖第一电介质材料的至少一部分，以及在第二电介质材料上形成导电层以形成电路触点。 导电层包括第一导电材料。

公开(公告)号：US20160254431A1

公开(公告)日：2016-09-01

申请号：US15147850

申请日：2016-05-05

Applicant: STARLITE LED INC.

Inventor： Pao Chen ,  Chung Chi Chang ,  Ming Chieh Huang

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/48 ,  H01L23/498 ,  H01L21/48 ,  H01L33/64

CPC classification number: H01L33/64 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract translation: 提供了一种用于制造LED封装基座的方法，包括提供具有顶表面和底表面的金属芯基片，并在金属芯基片中形成两个第一沟槽。 第一沟槽从顶表面延伸到底表面。 该方法还包括用第一介电材料至少部分地填充第一沟槽以形成电介质隔离。 电介质隔离将金属芯基板分成三个金属芯部分。 两个金属芯部分可以被配置为用作LED封装电极。 该方法还包括施加第二电介质材料以覆盖第一电介质材料的至少一部分，以及在第二电介质材料上形成导电层以形成电路触点。 导电层包括第一导电材料。