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公开(公告)号：WO2015160718A3
公开(公告)日：2015-10-22
申请号：PCT/US2015/025604
申请日：2015-04-13
Applicant: STARLITE LED INC.
Inventor： CHEN, Pao , CHANG, Chung Chi , HAN, Chang
Abstract: A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.
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公开(公告)号：WO2017065766A1
公开(公告)日：2017-04-20
申请号：PCT/US2015/055570
申请日：2015-10-14
Applicant: STARLITE LED INC.
IPC: H01L33/44
CPC classification number: H01L25/0753 , A01G7/045 , H01L33/32 , H01L33/504 , H01L33/62 , H01L33/642 , H05B33/0803 , H05B33/0857 , H05K1/05 , H05K3/284 , H05K2201/09054 , H05K2201/10106 , Y02P60/149
Abstract: Techniques for providing plant growth lights with improved performance and cost are discussed herein. Some embodiments may provide for a light emitting diode (LED) flip chip chip-on-board (COB) module for optimizing plant growth, including: a circuit board; ultraviolet (UV) LED flip chips connected to the circuit board; a royal-blue phosphor or fluorescent layer covering a first portion of the UV LED flip chips; and a deep-red phosphor or fluorescent layer covering a second portion of the UV LED flip chips. The royal-blue phosphor or fluorescent layer absorbs UV light generated by the first portion of the UV LED flip chips and converts the UV light into broad-band light in royal-blue spectrums. The a deep-red phosphor or fluorescent layer absorbs UV light generated by the second portion of the UV LED flip chips and converts the UV light into broad-band light in deep-red spectrums.
Abstract translation: 这里讨论了用于提供具有改进的性能和成本的植物生长灯的技术。 一些实施例可以提供用于优化植物生长的发光二极管（LED）倒装芯片板上芯片（COB）模块，其包括：电路板; 紫外（UV）LED倒装芯片连接到电路板; 覆盖UV LED倒装芯片的第一部分的皇家蓝色磷光体或荧光层; 以及覆盖UV LED倒装芯片的第二部分的深红色磷光体或荧光层。 皇家蓝色磷光体或荧光层吸收由第一部分UV LED倒装芯片产生的UV光，并将该UV光转换为皇家蓝色光谱中的宽带光。 深红色磷光体或荧光层吸收由第二部分UV LED倒装芯片产生的UV光并将UV光转换为深红色光谱中的宽带光。
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公开(公告)号：WO2016186667A1
公开(公告)日：2016-11-24
申请号：PCT/US2015/031817
申请日：2015-05-20
Applicant: STARLITE LED INC.
Inventor： CHEN, Pao , CHANG, Chung Chi
IPC: H01L33/48
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/486 , H01L33/644
Abstract: A multi-die light emitting diode (LED) module that includes an LED chip and a metal core printed circuit board (MCPCB). The LED chip may include a substrate and multiple LED dies formed on the substrate. The multiple LED dies may be electrically connected with each other using conductive bridges, and may interface with the MCPCB through two contact pads. A planar chip passivation layer may be disposed on the conductive bridges and the LED dies. Two contact pads providing external electrical connections for the LED chip may be formed on the planar chip passivation layer, and bonded to PCB bonding pads of the MCPCB. Some embodiments may further provide for improved thermal dissipation for a multi-die LED module. For example, a thermal pad may also be disposed on the surface of the planar chip passivation layer and bonded to a PCB bonding pad disposed on substrate mesa structure of the MCPCB.
Abstract translation: 一种包括LED芯片和金属芯印刷电路板（MCPCB）的多模发光二极管（LED）模块。 LED芯片可以包括基板和形成在基板上的多个LED管芯。 多个LED管芯可以使用导电桥彼此电连接，并且可以通过两个接触焊盘与MCPCB连接。 平面芯片钝化层可以设置在导电桥和LED管芯上。 提供用于LED芯片的外部电连接的两个接触焊盘可以形成在平面芯片钝化层上，并且结合到MCPCB的PCB焊盘。 一些实施例可以进一步提供用于多管芯LED模块的改进的散热。 例如，散热焊盘也可以设置在平面芯片钝化层的表面上并且结合到设置在MCPCB的衬底台面结构上的PCB焊盘。
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公开(公告)号：WO2015160718A2
公开(公告)日：2015-10-22
申请号：PCT/US2015025604
申请日：2015-04-13
Applicant: STARLITE LED INC
Inventor： CHEN PAO , CHANG CHUNG CHI , HAN CHANG
CPC classification number: H01L33/382 , H01L33/0079 , H01L33/46 , H01L51/5203 , H01L2933/0016
Abstract: A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.
Abstract translation: 制造发光二极管器件的方法包括沉积导电材料以覆盖导电和反射层的表面的一部分以形成第一接触焊盘和相邻第一沟槽之间的表面以形成第二接触焊盘; 以及在所述导电和反射层的表面的未覆盖部分上沉积第一钝化层以在所述第一接触焊盘和所述第二沟槽之间形成第一平面钝化接触表面，并且沉积接合材料以覆盖所述第一接触焊盘的表面的一部分， 所述第二接触焊盘的一部分和所述第一平面钝化接触件的一部分在所述第一接触焊盘上形成第一发光二极管接合焊盘，所述第二接触焊盘上的第二发光二极管接合焊盘和第三发光二极管接合焊盘 接合焊盘在第一平面钝化触点上。
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公开(公告)号：US09502628B2
公开(公告)日：2016-11-22
申请号：US14073643
申请日：2013-11-06
Applicant: Starlite LED Inc.
Inventor： Pao Chen , Chung Chi Chang , Ming Chieh Huang
CPC classification number: H01L33/64 , H01L21/4846 , H01L21/486 , H01L21/4871 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075
Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.
Abstract translation: 提供了一种用于制造LED封装基座的方法，包括提供具有顶表面和底表面的金属芯基片，并在金属芯基片中形成两个第一沟槽。 第一沟槽从顶表面延伸到底表面。 该方法还包括用第一介电材料至少部分地填充第一沟槽以形成电介质隔离。 电介质隔离将金属芯基板分成三个金属芯部分。 两个金属芯部分可以被配置为用作LED封装电极。 该方法还包括施加第二电介质材料以覆盖第一电介质材料的至少一部分，以及在第二电介质材料上形成导电层以形成电路触点。 导电层包括第一导电材料。
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Patent Agency Ranking
公开(公告)号：US20160254431A1
公开(公告)日：2016-09-01
申请号：US15147850
申请日：2016-05-05
Applicant: STARLITE LED INC.
Inventor： Pao Chen , Chung Chi Chang , Ming Chieh Huang
CPC classification number: H01L33/64 , H01L21/4846 , H01L21/486 , H01L21/4871 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075
Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.
Abstract translation: 提供了一种用于制造LED封装基座的方法，包括提供具有顶表面和底表面的金属芯基片，并在金属芯基片中形成两个第一沟槽。 第一沟槽从顶表面延伸到底表面。 该方法还包括用第一介电材料至少部分地填充第一沟槽以形成电介质隔离。 电介质隔离将金属芯基板分成三个金属芯部分。 两个金属芯部分可以被配置为用作LED封装电极。 该方法还包括施加第二电介质材料以覆盖第一电介质材料的至少一部分，以及在第二电介质材料上形成导电层以形成电路触点。 导电层包括第一导电材料。
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公开(公告)号：US09006005B2
公开(公告)日：2015-04-14
申请号：US14252604
申请日：2014-04-14
Applicant: Starlite Led Inc
IPC: H01L21/00 , H01L21/50 , H01L21/48 , H01L29/267 , H01L31/12 , H01L33/32 , H01L33/00 , H01L33/12 , H01L33/60 , H01L33/62 , H01L25/16 , H01L33/38 , H01L51/52 , H01L33/08 , H01L33/40
CPC classification number: H01L33/32 , H01L23/3677 , H01L25/167 , H01L33/0066 , H01L33/0075 , H01L33/0079 , H01L33/08 , H01L33/12 , H01L33/382 , H01L33/405 , H01L33/60 , H01L33/62 , H01L51/5237 , H01L51/5253 , H01L2224/48091 , H01L2933/0016 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.
Abstract translation: 制造发光二极管器件的方法包括沉积导电材料以覆盖导电和反射层的表面的一部分以形成第一接触焊盘和相邻第一沟槽之间的表面以形成第二接触焊盘; 以及在所述导电和反射层的表面的未覆盖部分上沉积第一钝化层以在所述第一接触焊盘和所述第二沟槽之间形成第一平面钝化接触表面，并且沉积接合材料以覆盖所述第一接触焊盘的表面的一部分， 所述第二接触焊盘的一部分和所述第一平面钝化接触件的一部分在所述第一接触焊盘上形成第一发光二极管接合焊盘，所述第二接触焊盘上的第二发光二极管接合焊盘和第三发光二极管接合焊盘 接合焊盘在第一平面钝化触点上。
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公开(公告)号：US09595650B2
公开(公告)日：2017-03-14
申请号：US15147850
申请日：2016-05-05
Applicant: STARLITE LED INC.
Inventor： Pao Chen , Chung Chi Chang , Ming Chieh Huang
CPC classification number: H01L33/64 , H01L21/4846 , H01L21/486 , H01L21/4871 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075
Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.
Abstract translation: 提供了一种用于制造LED封装基座的方法，包括提供具有顶表面和底表面的金属芯基片，并在金属芯基片中形成两个第一沟槽。 第一沟槽从顶表面延伸到底表面。 该方法还包括用第一介电材料至少部分地填充第一沟槽以形成电介质隔离。 电介质隔离将金属芯基板分成三个金属芯部分。 两个金属芯部分可以被配置为用作LED封装电极。 该方法还包括施加第二电介质材料以覆盖第一电介质材料的至少一部分，以及在第二电介质材料上形成导电层以形成电路触点。 导电层包括第一导电材料。
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公开(公告)号：US20140332820A1
公开(公告)日：2014-11-13
申请号：US14252604
申请日：2014-04-14
Applicant: STARLITE LED INC
CPC classification number: H01L33/32 , H01L23/3677 , H01L25/167 , H01L33/0066 , H01L33/0075 , H01L33/0079 , H01L33/08 , H01L33/12 , H01L33/382 , H01L33/405 , H01L33/60 , H01L33/62 , H01L51/5237 , H01L51/5253 , H01L2224/48091 , H01L2933/0016 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.
Abstract translation: 制造发光二极管器件的方法包括沉积导电材料以覆盖导电和反射层的表面的一部分以形成第一接触焊盘和相邻第一沟槽之间的表面以形成第二接触焊盘; 以及在所述导电和反射层的表面的未覆盖部分上沉积第一钝化层以在所述第一接触焊盘和所述第二沟槽之间形成第一平面钝化接触表面，并且沉积接合材料以覆盖所述第一接触焊盘的表面的一部分， 所述第二接触焊盘的一部分和所述第一平面钝化接触件的一部分在所述第一接触焊盘上形成第一发光二极管接合焊盘，所述第二接触焊盘上的第二发光二极管接合焊盘和第三发光二极管接合焊盘 接合焊盘在第一平面钝化触点上。
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公开(公告)号：US20150123161A1
公开(公告)日：2015-05-07
申请号：US14073643
申请日：2013-11-06
Applicant: Starlite LED Inc.
Inventor： Pao Chen , Chung Chi Chang , Min Jay Huang
IPC: H01L33/40
CPC classification number: H01L33/64 , H01L21/4846 , H01L21/486 , H01L21/4871 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075
Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface, The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.
Abstract translation: 提供了一种用于制造LED封装基座的方法，包括提供具有顶表面和底表面的金属芯基片，并在金属芯基片中形成两个第一沟槽。 第一沟槽从顶表面延伸到底表面。该方法还包括用第一介电材料至少部分地填充在第一沟槽中以形成绝缘隔离。 电介质隔离将金属芯基板分成三个金属芯部分。 两个金属芯部分可以被配置为用作LED封装电极。 该方法还包括施加第二电介质材料以覆盖第一电介质材料的至少一部分，以及在第二电介质材料上形成导电层以形成电路触点。 导电层包括第一导电材料。
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