公开(公告)号：US20210076507A1

公开(公告)日：2021-03-11

申请号：US16952021

申请日：2020-11-18

Applicant: STEMCO CO., LTD.

Inventor： Jae Soo LEE ,  Hyo Jin PARK ,  Sung Jin LEE ,  Dong Gon KIM

IPC: H05K3/46 ,  H05K1/02

Abstract: The present invention provides a multilayer circuit board and a method for manufacturing the same for improving a bowing problem that occurs when manufacturing the multilayer circuit board. A multilayer circuit board according to the present invention is a board having a patterned layer that functions as a circuit a base layer, and includes: a second pattern layer formed on one side of the base layer; a first pattern layer formed on the second pattern layer; and an interlayer insulating layer formed between the first pattern layer and the second pattern layer, the interlayer insulating layer being partially formed on the second pattern layer so as to correspond to a region where the first pattern layer is formed.