公开(公告)号：US20230413453A1

公开(公告)日：2023-12-21

申请号：US18459624

申请日：2023-09-01

Applicant: STEMCO CO., LTD.

Inventor： Sung Jin LEE ,  Kang Dong KIM ,  Chang Hoon HAN ,  Chul Ho YOON ,  Ho Byung KIM ,  Hyun Woo KIM ,  Gun Woo SHIN

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H05K3/103 ,  H05K3/3405 ,  H05K1/181 ,  H05K2203/0502 ,  H05K2201/08

Abstract: A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.

公开(公告)号：US20220287185A1

公开(公告)日：2022-09-08

申请号：US17753169

申请日：2020-07-31

Applicant: STEMCO CO., LTD.

Inventor： Jin Han LEE ,  Sung Jin LEE ,  Jin Ho KIM

IPC: H05K3/28 ,  H05K1/18

Abstract: A circuit board includes: a base substrate in which a protective layer formation region is defined; a wiring pattern which is formed on the base substrate and which has at least a portion formed in the protective layer formation region; a protective layer fixed onto the protective layer formation region and formed of a protective material; and a bleed prevention pattern formed on the base substrate so as to prevent the protective material from flowing beyond the protective layer formation region when the protective layer is formed.

公开(公告)号：US20210337675A1

公开(公告)日：2021-10-28

申请号：US17371327

申请日：2021-07-09

Applicant: STEMCO CO., LTD.

Inventor： Sung Jin LEE ,  Young Jun KIM ,  Su Jeong SHIN

IPC: H05K3/46 ,  H05K1/09 ,  H05K3/38 ,  H05K3/28

Abstract: Provided are a multilayer board and a method for manufacturing same, in which a different kind of metal layer is formed between an upper metal layer and an interlayer insulating layer, the different kind of metal layer being formed only in a wiring area without being formed in a via area. The multilayer board comprises: a substrate layer; a plurality of first metal layers sequentially stacked on the substrate layer; an interlayer insulating layer formed between two different first metal layers, having a first via hole, and electrically connecting the two different first metal layers through a third metal layer formed in the first via hole; and a second metal layer formed between the upper layer of the two different first metal layers and the interlayer insulating layer.

公开(公告)号：US20210076507A1

公开(公告)日：2021-03-11

申请号：US16952021

申请日：2020-11-18

Applicant: STEMCO CO., LTD.

Inventor： Jae Soo LEE ,  Hyo Jin PARK ,  Sung Jin LEE ,  Dong Gon KIM

IPC: H05K3/46 ,  H05K1/02

Abstract: The present invention provides a multilayer circuit board and a method for manufacturing the same for improving a bowing problem that occurs when manufacturing the multilayer circuit board. A multilayer circuit board according to the present invention is a board having a patterned layer that functions as a circuit a base layer, and includes: a second pattern layer formed on one side of the base layer; a first pattern layer formed on the second pattern layer; and an interlayer insulating layer formed between the first pattern layer and the second pattern layer, the interlayer insulating layer being partially formed on the second pattern layer so as to correspond to a region where the first pattern layer is formed.