公开(公告)号：US20240006420A1

公开(公告)日：2024-01-04

申请号：US18468553

申请日：2023-09-15

Applicant: STEMCO CO., LTD.

Inventor： Jin Han LEE

IPC: H01L27/12 ,  H01L25/065

CPC classification number: H01L27/124 ,  H01L25/0655

Abstract: A substrate package in which chip-on-films (COFs) are attached to both surfaces of a display panel and a display device including the substrate package are provided. The display device includes: a display panel displaying data on a screen; and a plurality of first packages and a plurality of second packages where chips for driving the display panel are installed, the first packages and the second packages being attached to an end portion of the display panel, wherein the first packages and the second packages are attached through different surfaces of the display panel.

公开(公告)号：US20220287185A1

公开(公告)日：2022-09-08

申请号：US17753169

申请日：2020-07-31

Applicant: STEMCO CO., LTD.

Inventor： Jin Han LEE ,  Sung Jin LEE ,  Jin Ho KIM

IPC: H05K3/28 ,  H05K1/18

Abstract: A circuit board includes: a base substrate in which a protective layer formation region is defined; a wiring pattern which is formed on the base substrate and which has at least a portion formed in the protective layer formation region; a protective layer fixed onto the protective layer formation region and formed of a protective material; and a bleed prevention pattern formed on the base substrate so as to prevent the protective material from flowing beyond the protective layer formation region when the protective layer is formed.

公开(公告)号：US20200375028A1

公开(公告)日：2020-11-26

申请号：US16990341

申请日：2020-08-11

Applicant: STEMCO CO., LTD.

Inventor： Jin Han LEE ,  Sung Bin PARK ,  Hiroo SHIMIZU ,  Dong Eun SON

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A flexible circuit board is provided. The flexible circuit board includes a base film with an outer lead region defined on either one surface or the other surface and an outer lead provided in the outer lead region and connected to an electronic device, in which the outer lead includes a plurality of first outer leads and a plurality of second outer leads formed to be spaced apart from each other so as to face each other in the outer lead region, and in which the number of the plurality of first outer leads is greater than the number of the plurality of second outer leads.