公开(公告)号：US20250145453A1

公开(公告)日：2025-05-08

申请号：US18925494

申请日：2024-10-24

Applicant: STMicroelectronics International N.V.

Inventor： Lorenzo CORSO ,  Federico VERCESI ,  Gabriele GATTERE ,  Anna GUERRA ,  Carlo VALZASINA ,  Giorgio ALLEGATO

IPC: B81B7/00 ,  B81C1/00

Abstract: MEMS device having a substrate of semiconductor material; a first structural layer of semiconductor material, on the substrate; a second structural layer of semiconductor material, on the first structural layer; an active portion, accommodating active structures formed in the first structural layer and/or in the second structural layer; a connection portion, accommodating a plurality of connection structures and arranged laterally to the active portion; and a plurality of conductive regions, arranged on the substrate and extending between the active portion and the connection portion. Each connection structure is formed by a first connection portion, in electrical contact with a respective conductive region and formed in the first structural layer, and by a second connection portion, on the first connection portion and in electrical continuity therewith, the second connection portion formed in the second structural layer. The first connection portion has a greater thickness than the second connection portion.

公开(公告)号：US20240391757A1

公开(公告)日：2024-11-28

申请号：US18663961

申请日：2024-05-14

Applicant: STMicroelectronics International N.V.

Inventor： Marco GARBARINO ,  Gabriele GATTERE

IPC: B81B3/00 ,  G01P15/125

Abstract: A microelectromechanical accelerometer includes a microstructure, having sensing terminals and driving terminals distinct from the sensing terminals, a supporting body and a movable mass, coupled to the supporting body so as to be able to oscillate according to a sensing axis with respect to a rest position, and a control unit coupled to the microstructure so as to form a force feedback loop configured to maintain the movable mass in the rest position. The movable mass includes a sensing structure and a driving structure, respectively coupled to the sensing terminals and to the driving terminals through capacitive couplings variable as a function of displacements of the movable mass from the rest position. The sensing structure and the driving structure are electrically insulated and rigidly coupled with each other.

公开(公告)号：US20250145451A1

公开(公告)日：2025-05-08

申请号：US18929345

申请日：2024-10-28

Applicant: STMicroelectronics International N.V.

Inventor： Gabriele GATTERE ,  Manuel RIANI

IPC: B81B3/00 ,  B81C1/00

Abstract: A microelectromechanical device includes: a supporting body, containing semiconductor material; a movable mass, constrained to the supporting body with a relative degree of freedom with respect to a first motion direction perpendicular to the supporting body; and at least one stopping structure, configured to limit out-of-plane movements of the movable mass along the first motion direction. The stopping structure includes: first elements, extending parallel to the first motion direction and anchoring the stopping structure to the supporting body; and a second element, extending transversally to the first elements, surmounting and connecting the first elements.

公开(公告)号：US20240426868A1

公开(公告)日：2024-12-26

申请号：US18738990

申请日：2024-06-10

Applicant: STMicroelectronics International N.V.

Inventor： Francesco RIZZINI ,  Gabriele GATTERE

IPC: G01P15/125 ,  G01P21/00

Abstract: A MEMS sensor comprising a semiconductor body and a mass elastically coupled to the semiconductor body for oscillating with respect to the semiconductor body in a oscillation direction in response to a force acting on the mass in the oscillation direction, the force being caused by an acceleration applied to the MEMS sensor. The mass and the semiconductor body define at least one measurement structure with parallel-plate electrodes, which is configured to measure capacitively a position of the mass that is indicative of the acceleration applied to the MEMS sensor. The mass and the semiconductor body further define a calibration structure with comb-finger electrodes that is electrically controllable, in a calibration mode of the MEMS sensor, to bring about electrostatically a displacement of the mass with respect to the semiconductor body in the oscillation direction.

公开(公告)号：US20240377198A1

公开(公告)日：2024-11-14

申请号：US18654869

申请日：2024-05-03

Applicant: STMicroelectronics International N.V.

Inventor： Gabriele GATTERE ,  Luca GUERINONI

IPC: G01C19/5762 ,  G01C19/5726

Abstract: Test method of a vibrational MEMS structure wherein, a direct, variable modification voltage is applied to a resonance modification test structure having non-rectilinear electrodes, modifying the resonance frequency of the movable mass and the driving frequency. During the test, the movable mass is verified about stability and, if not stable, the vibrational MEMS structure is rejected.