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公开(公告)号:EP0413451B1
公开(公告)日:2002-01-30
申请号:EP90308151.1
申请日:1990-07-25
Applicant: STMicroelectronics Limited
IPC: H01L23/498 , H01L23/057
CPC classification number: H01L22/32 , H01L22/20 , H01L23/057 , H01L23/498 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
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2.Semiconductor chip packages and modules formed of stacks of such packages 失效
Title translation: 半导体管芯封装和模块包括堆叠这样的包装的公开(公告)号:EP0430458B1
公开(公告)日:1999-03-03
申请号:EP90312152.3
申请日:1990-11-06
Applicant: STMicroelectronics Limited
CPC classification number: H01L23/50 , H01L25/105 , H01L2225/1029 , H01L2924/0002 , H01L2924/00
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