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公开(公告)号:EP0413451B1
公开(公告)日:2002-01-30
申请号:EP90308151.1
申请日:1990-07-25
Applicant: STMicroelectronics Limited
IPC: H01L23/498 , H01L23/057
CPC classification number: H01L22/32 , H01L22/20 , H01L23/057 , H01L23/498 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
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公开(公告)号:EP0629068B1
公开(公告)日:2003-01-22
申请号:EP94304142.6
申请日:1994-06-08
Applicant: STMicroelectronics Limited
Inventor: Walker, Christopher Paul Hulme
CPC classification number: H04L1/0057 , H04J3/0605 , H04J3/0632 , H04L1/0083 , H04L1/246 , H04L7/046 , H04L25/4908
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公开(公告)号:EP0629066B1
公开(公告)日:2003-01-22
申请号:EP94304135.0
申请日:1994-06-08
Applicant: STMicroelectronics Limited
Inventor: Walker, Christopher Paul Hulme
CPC classification number: H04L1/0083 , H04L25/4908
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4.Semiconductor chip packages and modules formed of stacks of such packages 失效
Title translation: 半导体管芯封装和模块包括堆叠这样的包装的公开(公告)号:EP0430458B1
公开(公告)日:1999-03-03
申请号:EP90312152.3
申请日:1990-11-06
Applicant: STMicroelectronics Limited
CPC classification number: H01L23/50 , H01L25/105 , H01L2225/1029 , H01L2924/0002 , H01L2924/00
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公开(公告)号:EP0611014B1
公开(公告)日:2004-03-24
申请号:EP94200820.2
申请日:1990-06-28
Applicant: STMicroelectronics Limited
Inventor: May, Michael David , Parsons, Brian Jeremy , Thompson, Peter William , Walker, Christopher Paul Hulme
CPC classification number: H04L49/30 , G06F15/17375 , H04L45/06 , H04L45/40 , H04L49/101 , H04L49/106 , H04L49/251 , H04L49/254 , H04L49/3009 , H04L49/3018 , H04L49/3027 , H04Q11/0478
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公开(公告)号:EP0629067B1
公开(公告)日:2003-01-22
申请号:EP94304141.8
申请日:1994-06-08
Applicant: STMicroelectronics Limited
Inventor: Walker, Christopher Paul Hulme
IPC: H04L25/49
CPC classification number: H04J3/0605 , H04L1/246 , H04L25/4908
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