公开(公告)号：EP1122720A1

公开(公告)日：2001-08-08

申请号：EP00830075.8

申请日：2000-02-02

Applicant: STMicroelectronics S.r.l.

Inventor： Murari, Bruno ,  Vigna, Benedetto ,  Sassolini, Simone ,  Ratti, Francesco ,  Alessandri, Alberto

IPC: G11B5/55

CPC classification number: G11B5/5552

Abstract: The manufacture process comprises: forming a first wafer (20) of semiconductor material housing integrated electronic components forming a microactuator control circuit and a signal preamplification circuit (22); forming microactuators (10), each comprising a rotor (52) and a stator (51), in a surface portion of a second wafer (28) of semiconductor material; attaching the second wafer (28) to the first wafer (20), with the surface portion of the second wafer facing the first wafer; thinning the second wafer (28); attaching the second wafer (28) to a third wafer (75) to obtain a composite wafer (78); thinning the first wafer (20); cutting the composite wafer (78) into a plurality of dice (77) connected to a protection chip (75'); removing the protection chip (75'); attaching read/write transducers (6) to the dice (77); and attaching the dice to supporting blocks (3) for hard-disk drivers (1).

Abstract translation: 制造方法包括：在形成微致动器控制电路和信号前置放大电路（22），半导体材料壳体集成电子部件的第一晶片（20）; 微致动器形成（10），每个包括一个转子（52）和在所述半导体材料的第二晶片（28）的表面部分的定子（51）; 附着在第二晶片（28）到所述第一晶片（20）具有面向所述第一晶片的第二晶片的表面部分; 减薄所述第二晶片（28）; 第二晶片（28）附接至第三晶片（75），以获得复合晶片（78）; 减薄第一晶片（20）; 切割所述复合晶片（78）插入连接到一个保护芯片（75“）的骰子的多个（77）; 去除保护芯片（75“）; 附接的读/写换能器（6）连接到骰子（77）; 和骰子附着到用于硬盘驱动器支撑块（3）（1）。