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公开(公告)号：EP3392637A1
公开(公告)日：2018-10-24
申请号：EP18163479.1
申请日：2018-03-22
Applicant: STMicroelectronics S.r.l.
Abstract: Stress sensor (1) formed by a membrane plate (4); a first bonding region (5) arranged on top of the membrane plate; a cover plate (6) arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional detection piezoresistive elements (11) extending on the membrane plate (4) that are embedded in the bonding layer; and planar detection piezoresistive elements (12) that extend across the membrane plate and are surrounded by and separated from the bonding layer.
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公开(公告)号：EP3392637B1
公开(公告)日：2019-11-27
申请号：EP18163479.1
申请日：2018-03-22
Applicant: STMicroelectronics S.r.l.
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