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    PRECURSOR SOLUTION AND METHOD FOR THE PREPARATION OF A LEAD-FREE PIEZOELECTRIC MATERIAL
    3.
    发明公开
    PRECURSOR SOLUTION AND METHOD FOR THE PREPARATION OF A LEAD-FREE PIEZOELECTRIC MATERIAL 审中-公开
    前体溶液和无铅压电材料的制备方法

    公开(公告)号：EP3176142A1

    公开(公告)日：2017-06-07

    申请号：EP16175558.2

    申请日：2016-06-21

    Applicant: STMicroelectronics S.r.l.

    Inventor： CIMMINO, Angela ,  SALZILLO, Giovanna ,  CASUSCELLI, Valeria ,  DI MATTEO, Andrea

    IPC: C04B35/468 ,  C01G23/00 ,  C04B35/622 ,  C04B35/624 ,  C04B35/632 ,  C04B35/634 ,  H01L41/187 ,  H01L41/318

    Abstract: The present invention relates to a precursor solution for the preparation of a ceramic of the BZT-αBXT type, where X is selected from Ca, Sn, Mn, and Nb, and α is a molar fraction selected in the range between 0.10 and 0.90, said solution comprising:
    1) at least one barium precursor compound;
    2) a precursor compound selected from the group consisting of at least one calcium compound, at least one tin compound, at least one manganese compound, and at least one niobium compound;
    3) at least one anhydrous precursor compound of zirconium;
    4) at least one anhydrous precursor compound of titanium;
    5) a solvent selected from the group consisting of a polyol and mixtures of a polyol and a secondary solvent selected from the group consisting of alcohols, carboxylic acids, esters, ketones, ethers, and their mixtures; and
    6) a chelating agent.
    The invention moreover relates to a method for the preparation of the precursor solution, to a piezoelectric material obtained from the precursor solution, to a method for the preparation of a film of the piezoelectric material, to a device comprising the piezoelectric material, and to the use of the piezoelectric material.

    Abstract translation: 本发明涉及用于制备BZT-αBXT型陶瓷的前体溶液，其中X选自Ca，Sn，Mn和Nb，并且α是选自0.10至0.90范围内的摩尔分数， 所述溶液包含：1）至少一种钡前体化合物; 2）选自至少一种钙化合物，至少一种锡化合物，至少一种锰化合物和至少一种铌化合物的前体化合物; 3）至少一种锆的无水前体化合物; 4）至少一种钛的无水前体化合物; 5）选自多元醇和多元醇与选自醇，羧酸，酯，酮，醚及其混合物的第二溶剂的混合物的溶剂; 和6）螯合剂。 本发明还涉及用于制备前体溶液的方法，由前体溶液获得的压电材料，涉及用于制备压电材料膜的方法，包括该压电材料的器件以及涉及 使用压电材料。

    MEMS PIEZOELECTRIC DEVICE AND CORRESPONDING MANUFACTURING PROCESS
    5.
    发明公开
    MEMS PIEZOELECTRIC DEVICE AND CORRESPONDING MANUFACTURING PROCESS 审中-公开
    MEMS压电器件及相应的制造工艺

    公开(公告)号：EP3185320A1

    公开(公告)日：2017-06-28

    申请号：EP16175277.9

    申请日：2016-06-20

    Applicant: STMicroelectronics S.r.l.

    Inventor： BEVILACQUA, Maria Fortuna ,  VILLA, Flavio Francesco ,  SCALDAFERRI, Rossana ,  CASUSCELLI, Valeria ,  DI MATTEO, Andrea ,  FARALLI, Dino

    IPC: H01L41/09 ,  H01L41/113 ,  H01L41/22 ,  H02N2/18

    CPC classification number: H01L41/1138 ,  H01L41/047 ,  H01L41/053 ,  H01L41/1134 ,  H01L41/1876 ,  H01L41/22 ,  H01L41/25 ,  H01L41/29 ,  H01L41/332 ,  H02N2/186

    Abstract: A MEMS piezoelectric device (20) has: a monolithic body (21) of semiconductor material, having a first main surface (21a) and a second main surface (21b), which are parallel to a horizontal plane (xy) formed by a first horizontal axis (x) and a second horizontal axis (y) and are opposite along a vertical axis (z); a housing cavity (22), arranged within the monolithic body (21); a membrane (23) suspended above the housing cavity (22), at the first main surface (21a) of the monolithic body; a piezoelectric material layer (30) arranged above a first surface (23a) of the membrane (23); an electrode arrangement (32), arranged in contact with the piezoelectric material layer (30); and a proof mass (24) coupled to a second surface (23b), opposite to the first surface (23a) along the vertical axis (z), of the membrane to cause deformation thereof in response to environmental mechanical vibrations. The proof mass is coupled to the membrane by a connection element (25) arranged, in a central position, between the membrane and the proof mass in the direction of the vertical axis (z). Main figure: Figure 3a

    Abstract translation: 一种MEMS压电器件（20），具有：由第一主表面（21a）和第二主表面（21b）构成的半导体材料的单片体（21），所述第一主表面（21a）和第二主表面（21b）平行于由第一主表面 水平轴（x）和第二水平轴（y）并沿着垂直轴（z）相反; 布置在所述单体主体（21）内的壳体腔（22）; 在整体式主体的第一主表面（21a）处悬挂在壳体空腔（22）上方的膜（23） 布置在所述膜（23）的第一表面（23a）上方的压电材料层（30）; 电极布置（32），布置成与压电材料层（30）接触; 和检测质量块（24），所述检测质量块（24）耦合到所述膜的与所述第一表面（23a）沿所述垂直轴（z）相反的第二表面（23b），以响应于环境机械振动而引起其变形。 检测质量块通过连接元件（25）联接到膜上，连接元件（25）在中心位置沿着垂直轴线（z）的方向布置在膜和检测质量块之间。 主要数字：图3a

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