公开(公告)号：EP4207613A1

公开(公告)日：2023-07-05

申请号：EP22211470.4

申请日：2022-12-05

Applicant: STMicroelectronics S.r.l.

Inventor： BENDOTTI, Valerio ,  GENNARI SANTORI, Valerio

IPC: H04B3/00 ,  H02M3/00

Abstract: An isolated driver device (10) comprises a first semiconductor die (10a) and a second semiconductor die (10b) galvanically isolated from each other. The second semiconductor die (10b) includes a signal modulator circuit (122) configured to modulate a carrier signal to produce a modulated signal ( FB ) encoding information. A galvanically isolated communication channel (113', 111P', 111N', 110') implemented in the first semiconductor die (10a) and the second semiconductor die (10b) is configured to transmit the modulated signal ( FB ) from the second semiconductor die (10b) to the first semiconductor die (10a). The second semiconductor die (10b) includes: a fault detection circuit (118) configured to detect electrical faults in the second semiconductor die (10b); a logic circuit (114) coupled to the fault detection circuit (118) and configured to assert a modulation bypass signal ( BP ) in response to a fault being detected by the fault detection circuit (118); and modulation masking circuitry (123) configured to force the modulated signal ( FB ) to a steady value over a plurality of periods of the carrier signal in response to the modulation bypass signal ( BP ) being asserted. The first semiconductor die (10a) includes a respective logic circuit (108) sensitive to the modulated signal ( FB , MOD) and configured to detect a condition where the modulated signal ( FB ) has a steady value over a plurality of periods of the carrier signal, and to assert a fault detection signal ( FAULT ) in response to the condition being detected.