公开(公告)号：EP1487015A1

公开(公告)日：2004-12-15

申请号：EP03425368.2

申请日：2003-06-10

Applicant: STMicroelectronics S.r.l.

Inventor： Andreini, Antonio ,  Cerati, Lorenzo ,  Galbiata, Paola ,  Merlini, Alessandra

IPC: H01L23/485 ,  H01L23/50

CPC classification number: H01L24/06 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/48463 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor electronic device is described comprising a die (2) of semiconductor material having a plurality of contact pads (3,8) electrically connected to a support for example through interposition of contact wires, said plurality of contact pads (3,8) comprising signal pads (8) and power pads (3), the device being characterised in that said signal pads (8) are implemented on the die (2) of semiconductor material with a mutual pitch (P2) lower than the pitch (P1) between said power pads (3), and in that the upper metallic layer of the signal pads is thinner than that of the power pads.

Abstract translation: 描述了一种半导体电子器件，其包括具有多个接触焊盘（3,8）的半导体材料的芯片（2），所述接触焊盘（3,8）例如通过插入接触导线而电连接到支撑件，所述多个接触焊盘（3,8）包括 信号焊盘（8）和电源焊盘（3），其特征在于，所述信号焊盘（8）实现在半导体材料的管芯（2）上，其间距（P2）低于第 所述电源焊盘（3），并且信号焊盘的上金属层比电源焊盘更薄。