Abstract:
An MOS electronic device (30) including: a drain region (31); a field insulating layer (33), covering the drain region; an opening (38) in the field insulating layer delimiting an active area (34); a body region (40) housed in the active area; a source region (41) housed in the body region. A portion of the body region comprised between the drain region and the source region forms a channel region (43). A polycrystalline silicon structure (45) extends along the edge of the opening delimiting the active area, partially on top of the field insulating layer and partially on top of the active layer. The polycrystalline silicon structure (45) comprises a gate region (46) extending along a first portion of the edge on top of the channel region (43) and partially surrounding the source region (41) and a non-operative region (47) extending along a second portion of the edge, electrically insulated and at a distance from the gate region, so as to reduce the drain/gate capacity and to increase the cutoff frequency of the MOS device.