公开(公告)号：EP4220692A1

公开(公告)日：2023-08-02

申请号：EP23153878.6

申请日：2023-01-30

Applicant: STMicroelectronics S.r.l.

Inventor： MAZZOLA, Mauro ,  MARCHISI, Fabio

IPC: H01L21/60 ,  H01L23/492

Abstract: A semiconductor device comprises one or more electrically conductive clips (18) arranged in a bridge-like position between a semiconductor chip (142) and an electrically conductive pad (12B). The clip (18) is soldered to the semiconductor chip (142) and to the electrically conductive pad (12B) via soldering material (22) applied at coupling surfaces facing towards the semiconductor chip (142) and the electrically conductive pad (12B). Prior to positioning the clip (18) in a bridge-like position between the semiconductor chip (142) and the electrically conductive pad (12B), one or more pairs of complementary positioning formations (100, 102) are formed comprising a cavity (102) formed in the electrically conductive clip (18) and a protrusion (100) comprised of a stack of stud bumps is formed in the electrically conductive pad (12B). With the electrically conductive clip (18) in a desired bridge-like position, the complementary positioning formations (100, 102) are mutually engaged and retain the conductive clip (18) in such a desired bridge-like position avoiding displacement during soldering.

公开(公告)号：EP4220693A1

公开(公告)日：2023-08-02

申请号：EP23153889.3

申请日：2023-01-30

Applicant: STMicroelectronics S.r.l.

Inventor： MAZZOLA, Mauro ,  MARCHISI, Fabio

IPC: H01L21/60 ,  H01L23/492

Abstract: A semiconductor device comprises one or more electrically conductive clips (18) arranged in a bridge-like position between a semiconductor chip (142) and an electrically conductive pad (12B).
The clip (18) is soldered to the semiconductor chip (142) and to the electrically conductive pad (12B) via soldering material (22) applied at coupling surfaces facing towards the semiconductor chip (142) and the electrically conductive pad (12B).
Prior to soldering, the clip or clips (18) are immobilized in the desired bridge-like position via welding, such as laser welding or gluing (G) at dedicated immobilization areas (180).