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1.Safeguard for integrated output power stages employing multiple bond-wires 失效
Title translation: 保护具有多个电源线集成的功率输出级公开(公告)号:EP0693784B1
公开(公告)日:2000-09-06
申请号:EP94830319.3
申请日:1994-06-24
Applicant: STMicroelectronics S.r.l.
Inventor: Marchio', Fabio , Pennisi, Alessio
IPC: H01L27/02
CPC classification number: H01L24/49 , G01R31/2853 , H01L24/48 , H01L2223/6611 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2224/49113 , H01L2924/00014 , H01L2924/01037 , H01L2924/01088 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2224/45099
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2.Manufacturing method for integrated circuits and semiconductor wafer so obtained 失效
Title translation: 一种用于产生制造集成电路和半导体晶片的方法公开(公告)号:EP0702402B1
公开(公告)日:2003-01-15
申请号:EP94830425.8
申请日:1994-09-13
Applicant: STMicroelectronics S.r.l.
Inventor: Murari, Bruno , Toscani, Roberto , Marchio', Fabio , Storti, Sandro
IPC: H01L21/66
CPC classification number: H01L22/32 , G01R31/2831 , G01R31/2884 , H01L27/0207 , H01L2224/05554 , H05K1/0266 , H05K1/0306 , H05K3/0097
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