Abstract:
Process for forming salicide on active areas of MOS transistors (10,11), each comprising a gate (2) and respective source and drain regions (5,12;7,13;5A,5B), the source and drain regions comprising each a first lightly doped sub-region (5;7;5A) adjacent the gate (2) and a second highly doped sub-region (12;13;5B) spaced apart from the gate (2), characterized in that the salicide is formed selectively at least over the second highly doped sub-regions (12;13;58) of the source and drain regions of the MOS transistors, and not over the first lightly doped sub-region (5;7;5A).
Abstract:
Process for forming salicide on active areas of MOS transistors (10,11), each comprising a gate (2) and respective source and drain regions (5,12;7,13;5A,5B), the source and drain regions comprising each a first lightly doped sub-region (5;7;5A) adjacent the gate (2) and a second highly doped sub-region (12;13;5B) spaced apart from the gate (2), characterized in that the salicide is formed selectively at least over the second highly doped sub-regions (12;13;58) of the source and drain regions of the MOS transistors, and not over the first lightly doped sub-region (5;7;5A).