公开(公告)号：EP1187201A1

公开(公告)日：2002-03-13

申请号：EP00830602.9

申请日：2000-09-06

Applicant: STMicroelectronics S.r.l.

Inventor： Motta, Valter ,  Frezza, Giovanni

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The present invention relates to a multiple-chip module comprising a package cavity (6) and a lead frame (26). The multiple-chip module has said lead frame (26) divided into die pad multiple islands (23, 24) and each of said die pad multiple islands (23; 24) is placed at different values of depression with respect to the plane (5) of said lead frame (26), so as to guarantee a perfect balanced resin's flow (27) in each part of said package cavity (6).

Abstract translation: 本发明涉及包括封装腔（6）和引线框（26）的多芯片模块。 多芯片模块具有被分成管芯焊盘多个岛（23,24）的所述引线框架（26），并且每个所述管芯焊盘多个岛（23; 24）相对于平面（5; ）的所述引线框架（26），以便在所述封装腔（6）的每个部分中保证完美平衡的树脂流动（27）。