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    Process for sealing devices incorporating microstructures
    1.
    发明公开
    Process for sealing devices incorporating microstructures 有权
    Verfahren zur Versegelung von Mikrostrukturen enthaltenden Bauelementen

    公开(公告)号：EP1312580A1

    公开(公告)日：2003-05-21

    申请号：EP01830712.4

    申请日：2001-11-16

    Applicant: STMicroelectronics S.r.l.

    Inventor： Sassolini, Simone ,  Del Sarto, Marco ,  Frezza, Giovanni ,  Baldo, Lorenzo

    IPC: B81C1/00 ,  B81B7/00

    CPC classification number: B81C1/00333

    Abstract: A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body (1) of semiconductor material, at least one microstructure (2) having at least one first portion (3) and one second portion (4) which are relatively mobile with respect to one another and are separated from one another by at least one gap region (14), which is accessible through a face (6) of the body (1); and sealing the gap (14). The sealing step includes depositing on the face (6) of the body (1) a layer (15) of protective material, in such a way as to close the gap region (14), the protective layer being such as to enable relative motion between the first portion (3) and the second portion (4) of the microstructure (2).

    Abstract translation: 一种制造集成保护微结构的器件的方法，包括以下步骤：在半导体材料的本体（1）中形成至少一个具有至少一个第一部分（3）和一个第二部分（3）的微结构（2） 4），它们相对于彼此相对移动并且通过至少一个可通过主体（1）的面（6）接近的间隙区域（14）彼此分离; 并密封间隙（14）。 密封步骤包括在主体（1）的表面（6）上沉积保护材料层（15），以便封闭间隙区域（14），保护层能够进行相对运动 在微结构（2）的第一部分（3）和第二部分（4）之间。

    Improved electronic device package and corresponding manufacturing method
    3.
    发明公开
    Improved electronic device package and corresponding manufacturing method 审中-公开
    Verbesserte elektronische Packungsanordnung und Herstellungsverfahrendafür

    公开(公告)号：EP1211721A1

    公开(公告)日：2002-06-05

    申请号：EP00830796.9

    申请日：2000-11-30

    Applicant: STMicroelectronics S.r.l.

    Inventor： Frezza, Giovanni

    IPC: H01L21/56

    CPC classification number: H01L21/565 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00

    Abstract: A plastic protective package (9) for a semiconductor-integrated electronic device, comprising a support (20) whereon an electronic circuit (30,30a) is placed that can be activated from the outside of said protective package (9), the protective package (9) being provided with a hole or a window (70) at the location of the sensor (30,30a).

    Abstract translation: 一种用于半导体集成电子器件的塑料保护封装（9），包括其上放置有可从所述保护封装（9）的外部启动的电子电路（30,30a）的支撑件（20），所述保护封装 （9）在传感器（30,30a）的位置处设置有孔或窗（70）。

    Manufacturing process of a stacked semiconductor device and corresponding device
    7.
    发明公开
    Manufacturing process of a stacked semiconductor device and corresponding device 审中-公开
    Herstellungverfahren einer gestapelten Halbleiteranordnung und entsprechende Vorrichtung

    公开(公告)号：EP1434267A1

    公开(公告)日：2004-06-30

    申请号：EP03029352.6

    申请日：2003-12-19

    Applicant: STMicroelectronics S.r.l.

    Inventor： Frezza, Giovanni

    IPC: H01L25/065 ,  H01L21/98

    CPC classification number: H01L25/50 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15311 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49135 ,  Y10T29/49137 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A manufacturing process of a stacked semiconductor device (14) is described, comprising the following steps:

    integrating a plurality of electronic devices in a plurality of active areas realised in a semiconductor wafer (9a),
    distributing an adhesive layer (10) on active areas,
    splitting the semiconductor wafer (9a) into a plurality of first dies (9), each one comprising at least one of the active areas;
    mounting the plurality of first dies (9), which are already equipped with the adhesive layer (10), on a support (7),
    mounting a plurality of second dies (12) on the adhesive layer (10).

    A stacked semiconductor device (14) is also described, which comprises a first die (9) mounted on a support (7), an intermediate adhesive layer (10) and a second die (12) mounted on the adhesive layer (10) which is a polymeric layer.

    Abstract translation: 描述了层叠半导体器件（14）的制造工艺，其包括以下步骤：在半导体晶片（9a）中实现的多个有源区域中集成多个电子器件，将粘合剂层（10）分布在有源区域 ，将半导体晶片（9a）分成多个第一裸片（9），每个第一裸片（9）包括至少一个有效区域; 将已经配备有粘合剂层（10）的多个第一模具（9）安装在支撑件（7）上，将多个第二模具（12）安装在粘合剂层（10）上。 还描述了一种叠层半导体器件（14），其包括安装在支撑体（7）上的第一模具（9），安装在粘合剂层上的中间粘合剂层（10）和第二模具（12） （10），其是聚合物层。

    A method for manufacturing a moulded MMC multi media card package obtained with laser cutting
    9.
    发明公开
    A method for manufacturing a moulded MMC multi media card package obtained with laser cutting 有权
    Verfahren zur Herstellung einer MMC-Multimediakarte mittels Spritzguss- und Laserschneidverfahren

    公开(公告)号：EP1630729A1

    公开(公告)日：2006-03-01

    申请号：EP04425646.9

    申请日：2004-08-31

    Applicant: STMicroelectronics S.r.l.

    Inventor： Tiziani, Roberto ,  Frezza, Giovanni

    IPC: G06K19/077 ,  G06K19/04

    CPC classification number: G06K19/077 ,  G06K19/041

    Abstract: The present invention relates to a method for manufacturing a fully moulded Multi Media Card package (5) obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method is defined by the following steps:

    providing a rounded groove (4) on a substrate (2) back side (8) of the package, all around the package profile;
    cutting the edges of said package (5) by a laser cutting line (9) passing through said groove (4).

    This new technique permits to use all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

    Abstract translation: 本发明涉及一种用于制造通过激光切割获得的完全成型的多媒体卡封装（5）的方法，其中至少一些边缘和封装周围的角部具有圆形轮廓并且具有足够的平滑度以进行安全处理。 该方法通过以下步骤限定：在包装的背面（8）的基板（2）上提供围绕包装轮廓的圆形凹槽（4） 通过穿过所述凹槽（4）的激光切割线（9）切割所述包装（5）的边缘。 这种新技术允许使用MMC封装的所有24.0mm宽度的基板2，从而增加可用于电子部件的表面。

    Manufacturing method of electronic device package
    10.
    发明公开
    Manufacturing method of electronic device package 有权
    的电子封装组件的制造工序

    公开(公告)号：EP1211722A1

    公开(公告)日：2002-06-05

    申请号：EP01204797.3

    申请日：2001-11-29

    Applicant: STMicroelectronics S.r.l.

    Inventor： Frezza, Giovanni

    IPC: H01L21/56

    CPC classification number: H01L21/565 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A method for forming by molding a plastic protective package (9) for an electronic integrated circuit comprising an electronic device (30, 30a) activated from the outside of said protective package (9), comprising the following steps:

    dispensing a covering layer (50) of elastic material on a portion of said electronic device (30, 30a);
    shaping said covering layer (50) to form a projecting portion (51) from a surface of said electronic device (30, 30a);
    molding said electronic integrated circuit in said plastic protective package (9) using a mold including at least a half-mold abutting against said projecting portion (51);
    obtaining a hole (70) or a window formed in alignment with said projecting portion (51) in said protective package.

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