公开(公告)号：EP0948050A1

公开(公告)日：1999-10-06

申请号：EP98830172.7

申请日：1998-03-24

Applicant: STMicroelectronics S.r.l.

Inventor： Frisina, Feruccio ,  Percolla, Giuseppe ,  Fragapane, Leonardo

IPC: H01L27/02 ,  H01L23/485

CPC classification number: H01L29/7808 ,  H01L23/62 ,  H01L24/05 ,  H01L29/4238 ,  H01L29/7811 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The device comprises a chip of semiconductor material (10), a plate (14) of insulating material on the chip, a conducting strip of doped semiconductor material which has a portion (15) which extends over the plate (14), a portion (16) of a layer of semiconductor material which extends over the plate (14) and contains active regions and a metallic element (17) which is in contact with the portion (15) of conducting strip which extends over the plate (14) and has an area (20) designed to be used for electrical connection to a terminal, outside the chip, of the electronic device. To increase the useful area of the chip, the metallic element (17) extends in large part over the portion (16) of the layer of semiconductor material containing active regions, and is separated from this portion (16) by a layer of insulating material.

Abstract translation: 该器件包括半导体材料芯片（10），芯片上的绝缘材料板（14），掺杂半导体材料的导电条，其具有在板（14）上延伸的部分（15），部分 在所述板（14）上延伸并且包含有源区域的金属元件（17），所述金属元件（17）与所述板（14）上延伸的导电条的所述部分（15）接触并具有 设计用于与芯片外的终端电连接的电子设备的区域（20）。 为了增加芯片的有用面积，金属元件（17）大部分地延伸在含有活性区域的半导体材料层的部分（16）上，并且通过绝缘材料层与该部分（16）分离 。