Abstract:
The invention relates to an electronic power device (1) of improved structure and fabricated with MOS technology to have at least one gate finger region (3) and corresponding source regions (4) on opposite sides of the gate region (3). This device (1) has at least one first-level metal layer (3',4') arranged to independently contact the gate region (3) and source regions, and has a protective passivation layer (5) arranged to cover the gate region (3). Advantageously, a wettable metal layer (7), deposited onto the passivation layer (5) and the first-level metal layer (4'), overlies said source regions (4). In this way, the additional wettable metal layer (7) is made to act as a second-level metal.
Abstract:
The invention relates to an electronic power device (1) of improved structure and fabricated with MOS technology to have at least one gate finger region (3) and corresponding source regions (4) on opposite sides of the gate region (3). This device (1) has at least one first-level metal layer (3',4') arranged to independently contact the gate region (3) and source regions, and has a protective passivation layer (5) arranged to cover the gate region (3). Advantageously, a wettable metal layer (7), deposited onto the passivation layer (5) and the first-level metal layer (4'), overlies said source regions (4). In this way, the additional wettable metal layer (7) is made to act as a second-level metal.