Wafer supporting device
    1.
    发明公开
    Wafer supporting device 审中-公开
    Waferhaltevorrichtung

    公开(公告)号:EP1146545A1

    公开(公告)日:2001-10-17

    申请号:EP00830268.9

    申请日:2000-04-10

    CPC classification number: H01L21/687

    Abstract: A silicon wafer supporting device, for the evaporation of the wafer backside, comprising a plate-like element (10); its particularity consists of the fact that it comprises at least one blind seat (11) which is formed at the lower surface of the plate-like element (10) and is adapted to accommodate at least one silicon wafer (2) whose lower side must be subjected to a metallization process, a plurality of bracket-like elements (12) being rigidly fixed to the plate-like element (10) and being adapted to support the at least one silicon wafer (2) at its perimeter.

    Abstract translation: 一种硅晶片支撑装置,用于晶片背面的蒸发,包括板状元件(10); 其特殊性在于它包括至少一个盲板座(11),其形成在板状元件(10)的下表面处,并且适于容纳至少一个硅晶片(2),其中下侧必须 经受金属化处理,多个支架状元件(12)刚性地固定到板状元件(10)上并且适于在其周边支撑至少一个硅晶片(2)。

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