公开(公告)号：EP4258832A1

公开(公告)日：2023-10-11

申请号：EP23164244.8

申请日：2023-03-27

Applicant: STMicroelectronics S.r.l.

Inventor： SAVINO, Sergio ,  SALAMONE, Francesco

IPC: H05K7/14 ,  H01L23/498

Abstract: Power module (1) packaged in a housing (2) accommodating a carrying substrate (10) forming a plurality of connection regions (14A-14D) of conductive material. An electronic component (15A, 10B) is arranged inside the housing, attached to a connection region (14A, 14B) of the plurality of connection regions (14A-14D). An electrical connector (5), coupled to the electronic component, extends towards the main surface (2A) of the housing (2) and is accessible from the outside of the housing. The electrical connector has a tubular portion forming a pillar (8) fixed to a pin which protrudes from the main surface of the housing. The housing (2) includes a packaging mass (3) of electrically insulating material that embeds the pillar (8) and blocks it therein.

公开(公告)号：EP4297081A1

公开(公告)日：2023-12-27

申请号：EP23177548.7

申请日：2023-06-06

Applicant: STMicroelectronics S.r.l.

Inventor： SAVINO, Sergio

IPC: H01L23/492 ,  H01L25/07 ,  H01L23/498

Abstract: Power module (2) having a support (35); a first control contact area (36B) on the support; a second control contact area (36C) on the support; a first electronic power device (28.1); a second electronic power device (28.2); a first clip (20); a second clip (21); a third clip (22); and a package (9) embedding the support, the first and the second electronic power devices as well as partially the first, the second and the third clips. The first electronic power device (28.1) has a first conduction pad (30) electrically coupled to the first clip (20); a second conduction pad (31) electrically coupled to the third clip (22) and a control pad (32) coupled to the first control contact area (36B). The second electronic power device (28.2) has a first conduction pad (30) electrically coupled to the third clip (22), a second conduction pad (31) electrically coupled to the second clip (21), and a control pad (32) coupled to the second control contact area (36C). The first and the second electronic power devices form a half-bridge circuit (1).