公开(公告)号：EP4378883A1

公开(公告)日：2024-06-05

申请号：EP23207483.1

申请日：2023-11-02

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  QUAGLIA, Fabio ,  FERRERA, Marco ,  PRELINI, Carlo Luigi ,  SAVOIA, Alessandro Stuart

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81C2203/079220130101

Abstract: MEMS device (1) comprising: a signal processing assembly (120); a transduction module (38; 40, 41, 56) comprising a plurality of transducer devices (56); a stiffening structure (113) at least partially surrounding each transducer device (56); one or more coupling pillars (36) for each transducer device (56), extending on the stiffening structure (113) and configured to physically and electrically couple the transduction module (38; 40, 41, 56) to the signal processing assembly (120), to carry control signals of the transducer devices (56). Each conductive coupling element (36) has a section having a shape such as to maximize the overlapping surface with the stiffening structure (113) around the respective transducer device (56). This shape includes hypocycloid with a number of cusps equal to or greater than three; triangular; quadrangular.