公开(公告)号：EP1367644A1

公开(公告)日：2003-12-03

申请号：EP02425348.6

申请日：2002-05-29

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Renard, Loic ,  Vitali, Battista

IPC: H01L23/495 ,  H01L21/607 ,  H01L23/485

CPC classification number: H01L24/85 ,  H01L23/4952 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05073 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20757 ,  H01L2924/2076 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device (1) is disclosed, which comprises a die (2) of a semiconductor material and a holder (3) connected electrically together by wire leads (4) of copper, the semiconductor material die being formed with a plurality of contact pads (6), the device being characterized in that it comprises a welding stud bump (7) of a metal material selected from a group comprising gold, palladium, and alloys thereof, formed on each contact pad of said plurality of contact pads, each copper wire lead (4) being welded with one end (4a) on a stud bump (7) and with the other end to said holder (3). This electronic device is highly reliable and can be fabricated simply at a low cost.

Abstract translation: 公开了一种半导体电子器件（1），其包括半导体材料的管芯（2）和由铜的引线（4）电连接的保持器（3），所述半导体材料管芯形成有多个接触 焊盘（6），其特征在于，其包括形成在所述多个接触焊盘的每个接触焊盘上的金，金属的选自包括金，钯及其合金的金属材料的焊接凸块（7） 铜线引线（4）与一端（4a）焊接在螺柱凸块（7）上，另一端与所述支架（3）焊接。 该电子设备是高度可靠的，并且可以以低成本简单地制造。