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    Process for preparing a bonding resin
    3.
    发明专利
    Process for preparing a bonding resin 未知

    公开(公告)号：SE543465C2

    公开(公告)日：2021-02-23

    申请号：SE1850469

    申请日：2018-04-20

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  EKSTRÖM JESPER

    IPC: C08H8/00 ,  C09J197/00 ,  C08L97/00 ,  C09J161/00

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein a first resin prepared from lignin, formaldehyde and optionally phenol is mixed with a second resin prepared from lignin, formaldehyde and optionally phenol, wherein the first resin is different from the second resin, to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.

    Process for preparing a bonding resin
    4.
    发明专利
    Process for preparing a bonding resin 未知

    公开(公告)号：SE1950773A1

    公开(公告)日：2020-12-25

    申请号：SE1950773

    申请日：2019-06-24

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  EKSTRÖM JESPER

    IPC: C09J197/00 ,  B27N3/00 ,  B32B21/00 ,  C08H7/00 ,  C08L63/00 ,  C08L97/00 ,  C09J163/00

    Abstract: The present invention relates to a process for preparing a bonding resin, lignin in solid form is mixed with one or more of glycerol diglycidyl ether, diglycerol polyglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, hexahydrophtalic acid diglycidylester and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives followed by addition of a basic solution. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards, laminates or mineral wool insulation.

    PROCESS FOR PREPARING A SOLUTION OF LIGNIN IN AN AQUEOUS MEDIUM
    7.
    发明专利
    PROCESS FOR PREPARING A SOLUTION OF LIGNIN IN AN AQUEOUS MEDIUM 未知

    公开(公告)号：SE1851470A1

    公开(公告)日：2020-05-28

    申请号：SE1851470

    申请日：2018-11-27

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR BEN ,  ZAFAR ASHAR ,  EKSTRÖM JESPER

    Abstract: The present invention relates to a process for lignin dissolution in which partial methylolation of lignin is carried out during the step of preparing a solution of lignin in an aqueous medium comprising alkali and phenol.The lignin prepared according to the process of the present invention can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.

    Adhesive formulation comprising lignin
    8.
    发明专利
    Adhesive formulation comprising lignin 未知

    公开(公告)号：SE1850470A1

    公开(公告)日：2019-10-21

    申请号：SE1850470

    申请日：2018-04-20

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  EKSTRÖM JESPER

    IPC: C09J197/00 ,  C08H8/00 ,  C08L97/00 ,  C09J161/00

    Abstract: The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products. The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenolformaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL). The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

    Process for preparing a bonding resin
    9.
    发明专利
    Process for preparing a bonding resin 未知

    公开(公告)号：SE1850469A1

    公开(公告)日：2019-10-21

    申请号：SE1850469

    申请日：2018-04-20

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  EKSTRÖM JESPER

    IPC: C09J197/00 ,  C08H8/00 ,  C08L97/00 ,  C09J161/00

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein a first resin prepared from lignin, formaldehyde and optionally phenol is mixed with a second resin prepared from lignin, formaldehyde and optionally phenol, wherein the first resin is different from the second resin, to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.

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