Abstract:
The present invention relates to a composition for coating, in particular a composition comprising lignin and one or more epoxy-group containing compounds, and methods for the manufacturing thereof and uses thereof. The present invention also relates to products obtainable by said methods and uses thereof.
Abstract:
The present invention is directed to a process for preparing coating compositions containing up to 100% bio-based content. The coating compositions are used for coating metal, paper and wood substrates in various applications. The process for preparing the coating composition comprises the steps of providing lignin, wherein the lignin is agglomerated and has a particle size distribution such that at least 80 wt-% of the agglomerates have a diameter within the range of from 0.2 mm to 5.0 mm, dissolving the agglomerated lignin in an organic solvent, and mixing the solution with a crosslinker to obtain a coating composition.
Abstract:
La presente invención se refiere a un proceso para preparar una resina adhesiva, donde la lignina es proporcionada en la forma de una solución acuosa y se mezcla con uno o más de glicerol diglicidil éter, poliglicerol diglicidil éter, poliglicerol poliglicidil éter, glicerol triglicidil éter, sorbitol poliglicidil éter, glicerol alcoxilado poliglicidil éter, trimetilolpropano triglicidil éter, trimetilolpropano diglicidil éter, polioxipropilen glicol diglicidil éter, polioxipropilen glicol triglicidil éter, diglicidil éter de ciclohexano dimetanol, resorcinol diglicidil éter, isosorbide diglicidil éter, pentaeritritol tetraglicidil éter, etilen glicol diglicidil éter, polietien glicol diglicidil éter que tiene de 2 a 9 unidades de etilen glicol, propilen glicol diglicidil éter que tiene de 1 a 5 unidades de propilen glicol, y/o diglicidil éter de diol terminal que tiene una cadena lineal de carbono de 3 a 6 átomos de carbono; y opcionalmente uno o más aditivos. La resina adhesiva es útil por Ejemplo en la fabricación de laminados, aislantes de lana mineral y productos de madera como la madera contrachapada, los tableros de fibra orientada (OSB), la madera de chapa laminada (LVL), los tableros de fibra de densidad media (MDF), los tableros de fibra de alta densidad (HDF), los suelos de parquet, la madera contrachapada curvada, los tableros de partículas chapados, los MDF chapados o los tableros de partículas.
Abstract:
The present invention relates to a process for lignin dissolution in which partial methylolation of lignin is carried out during the step of preparing a solution of lignin in an aqueous medium comprising alkali and phenol.The lignin prepared according to the process of the present invention can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.
Abstract:
The present invention relates to a process for lignin dissolution in which partial methylolation of lignin is carried out during the step of preparing a solution of lignin in an aqueous medium comprising alkali and phenol.The lignin prepared according to the process of the present invention can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.
Abstract:
The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products. The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenolformaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL). The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.
Abstract:
The present invention relates to a process for preparing a bonding resin, wherein a first resin prepared from lignin, formaldehyde and optionally phenol is mixed with a second resin prepared from lignin, formaldehyde and optionally phenol, wherein the first resin is different from the second resin, to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.
Abstract:
The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde is mixed with a resin prepared from phenol and formaldehyde to achieve a mixture useful as a bonding resin useful in the manufacture of oriented strand board (OSB).
Abstract:
The present invention relates to a liquid lignin composition, particularly useful in the manufacture of resins for products such as insulation, laminates and engineered wood products such as oriented strand boards (OSB). The liquid lignin composition has a low viscosity even at low water content.