公开(公告)号：SE541653C2

公开(公告)日：2019-11-19

申请号：SE1751364

申请日：2017-11-03

Applicant: STORA ENSO OYJ

Inventor： HALONEN EERIK ,  IKONEN JUHA ,  HUHTASALO LAURI

IPC: G06K19/077 ,  B32B37/12 ,  H01Q1/22 ,  H05K3/32

Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.

公开(公告)号：SE1751364A1

公开(公告)日：2019-05-04

申请号：SE1751364

申请日：2017-11-03

Applicant: STORA ENSO OYJ

Inventor： HALONEN EERIK ,  IKONEN JUHA ,  HUHTASALO LAURI

IPC: B32B37/12 ,  G06K19/077 ,  H01Q1/22 ,  H05K3/32

Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating, the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melts, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidifies, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.