公开(公告)号：SE1951287A1

公开(公告)日：2021-05-09

申请号：SE1951287

申请日：2019-11-08

Applicant: STORA ENSO OYJ

Inventor： IKONEN JUHA ,  HUHTASALO LAURI

IPC: G06K19/077 ,  H01Q1/22

Abstract: The present invention relates to an RFID label (1) comprising an RFID tag (7) which tag comprises an RFID antenna (5) and an IC (6), which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate (2) with a first surface (3) and a second surface (4), wherein the first surface is siliconized, and the second surface is carrying the RFID tag (7), and a sticky adhesive layer (8) which is arranged onto the second surface of the substrate and over the RFID tag.

公开(公告)号：SE543748C2

公开(公告)日：2021-07-13

申请号：SE1951287

申请日：2019-11-08

Applicant: STORA ENSO OYJ

Inventor： IKONEN JUHA ,  HUHTASALO LAURI

IPC: G06K19/077 ,  H01Q1/22

Abstract: A BS T R A C TThe present invention relates to an RFID label (1) comprising an RFID tag (7) which tag comprises an RFID antenna (5) and an IC (6), which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate (2) with a first surface (3) and a second surface (4), wherein the first surface is siliconized, and the second surface is carrying the RFID tag (7), and a sticky adhesive layer (8) which is arranged onto the second surface of the substrate and over the RFID tag.

公开(公告)号：SE541653C2

公开(公告)日：2019-11-19

申请号：SE1751364

申请日：2017-11-03

Applicant: STORA ENSO OYJ

Inventor： HALONEN EERIK ,  IKONEN JUHA ,  HUHTASALO LAURI

IPC: G06K19/077 ,  B32B37/12 ,  H01Q1/22 ,  H05K3/32

Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.

公开(公告)号：SE1751364A1

公开(公告)日：2019-05-04

申请号：SE1751364

申请日：2017-11-03

Applicant: STORA ENSO OYJ

Inventor： HALONEN EERIK ,  IKONEN JUHA ,  HUHTASALO LAURI

IPC: B32B37/12 ,  G06K19/077 ,  H01Q1/22 ,  H05K3/32

Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating, the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melts, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidifies, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.