公开(公告)号：US20160243577A1

公开(公告)日：2016-08-25

申请号：US15146006

申请日：2016-05-04

Applicant: STORA ENSO OYJ

Inventor： Petri SIRVIÖ ,  Juha MAIJALA

IPC: B05C1/00 ,  B05C19/00

CPC classification number: B05C1/003 ,  B05C19/008 ,  B05D1/007 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/029 ,  B05D3/06 ,  B05D3/12 ,  C23C26/02 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/102 ,  H05K3/1241 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2201/0293 ,  H05K2203/0126 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/102 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/1581

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract translation: 公开了用于在表面上产生导电图案的方法和装置。 将导电固体颗粒转移到基板表面上的预定形式的区域上。 将导电固体颗粒加热到高于导电固体颗粒的特征熔点的温度，从而产生熔体。 熔融物在辊隙中被压靠在基底上，其中一部分辊隙对熔体的表面温度低于所述特征熔点。

公开(公告)号：US20170330845A1

公开(公告)日：2017-11-16

申请号：US15663396

申请日：2017-07-28

Applicant: STORA ENSO OYJ

Inventor： Juha MAIJALA

IPC: H01L23/66 ,  H05K1/02 ,  B65D25/00 ,  H01L23/498 ,  H01L23/58 ,  H01L23/64 ,  A61J1/03 ,  H05K3/30 ,  H01L23/00 ,  H05K3/00 ,  H05K1/16 ,  H05K1/11

CPC classification number: H01L23/66 ,  A61J1/035 ,  A61J2200/30 ,  A61J2205/60 ,  B65D25/00 ,  B65D2203/10 ,  H01L23/4985 ,  H01L23/564 ,  H01L23/585 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/0239 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0292 ,  H05K1/111 ,  H05K1/165 ,  H05K3/0052 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09954 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.