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    System and method for tracking products in open-loop supply or value chain
    1.
    发明授权
    System and method for tracking products in open-loop supply or value chain 有权

    公开(公告)号：US10943206B2

    公开(公告)日：2021-03-09

    申请号：US15766439

    申请日：2016-10-05

    Applicant: Stora Enso OYJ

    Inventor： Juha Maijala ,  Petri Sirvio

    IPC: G06Q10/08 ,  G06K19/07

    Abstract: A system for monitoring the life cycle of a product even in open-loop retail environment having regard to the associated supply or value chain, comprising tag provision equipment arranged to obtain product information and to configure a wirelessly interrogatable electronic identification tag provided with externally readable identification information to a product item, wherein configuring incorporates at least partially automated determination, according to predefined decision logic, of at least one technical characteristic of tag implementation based on the product information to optimize the operation of the tag, and electronic data management system accessible via a communications network, preferably the Internet, comprising a data interface configured to receive and transmit data, and a data repository configured to store indications of received digital notifications of tag reading events in a plurality of activities of the associated supply or value chain, said notifications conveying said tag identification information. A corresponding method for execution by the system is presented.

    Method and an arrangement for producing electrically conductive patterns on substrates
    2.
    发明授权
    Method and an arrangement for producing electrically conductive patterns on substrates 有权

    公开(公告)号：US10887998B2

    公开(公告)日：2021-01-05

    申请号：US15576340

    申请日：2016-05-23

    Applicant: Stora Enso OYJ

    Inventor： Juha Maijala ,  Petri Sirviö

    IPC: H05K3/12 ,  H05K3/10 ,  H05K3/40 ,  H05K3/32 ,  H05K1/09

    Abstract: A method (200, 300, 500) for producing an electrically conductive pattern on substrate (202, 402), comprising: providing electrically conductive solid particles onto an area of the substrate in a predefined pattern (508), where the pattern (403) comprises a contact area (404B) for connecting to an electronic component and a conductive structure (404A) having at least a portion (414) adjacent to the contact area, heating the conductive particles to a temperature higher than a characteristic melting point of the particles to establish a melt (510), and pressing the melt against the substrate in a nip, the temperature of the contact portion of which being lower than the aforesaid characteristic melting point so as to solidify the particles into essentially electrically continuous layer within the contact area and within the conductive structure in accordance with the pattern (512), wherein the thermal masses of the contact area and the at least adjacent portion of the conductive structure are configured substantially equal.

    Apparatus and method for component positining
    8.
    发明授权
    Apparatus and method for component positining 有权

    公开(公告)号：US10658209B2

    公开(公告)日：2020-05-19

    申请号：US15548801

    申请日：2016-02-02

    Applicant: Stora Enso OYJ

    Inventor： Juha Maijala ,  Petri Sirvio ,  Tommi Jokinen

    IPC: H05K3/30 ,  H01L21/67 ,  H05K13/04 ,  H05K13/02 ,  H05K13/08 ,  H01L21/68 ,  H05K3/12

    Abstract: Apparatus (200, 300, 400) for component positioning comprises at least one receptacle (212, 412) configured to receive a number of components (103) to be placed on a target substrate (108, 111), agitator (210, 410) configured to exert force impulses, such as abrupt force impulses, on the receptacle so as to cause the components to change their position inside the receptacle, inspection equipment (216, 316, 416) configured to verify the position of the components inside the receptacle, and pick and place equipment (206, 306, 406) configured to pick one or more components from the receptacle that fulfil a predefined position criterion and place the components on the target substrate. A related method for component positioning is presented.

    METHOD AND AN ARRANGEMENT FOR PRODUCING ELECTRICALLY CONDUCTIVE PATTERNS ON SUBSTRATES
    9.
    发明申请
    METHOD AND AN ARRANGEMENT FOR PRODUCING ELECTRICALLY CONDUCTIVE PATTERNS ON SUBSTRATES 审中-公开

    公开(公告)号：US20180168048A1

    公开(公告)日：2018-06-14

    申请号：US15576340

    申请日：2016-05-23

    Applicant: Stora Enso OYJ

    Inventor： Juha Maijala ,  Petri Sirviö

    IPC: H05K3/12 ,  H05K3/32

    CPC classification number: H05K3/1275 ,  H05K1/092 ,  H05K3/102 ,  H05K3/1283 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/1131 ,  H05K2203/1545

    Abstract: A method (200, 300, 500) for producing an electrically conductive pattern on substrate (202, 402), comprising: providing electrically conductive solid particles onto an area of the substrate in a predefined pattern (508), where the pattern (403) comprises a contact area (404B) for connecting to an electronic component and a conductive structure (404A) having at least a portion (414) adjacent to the contact area, heating the conductive particles to a temperature higher than a characteristic melting point of the particles to establish a melt (510), and pressing the melt against the substrate in a nip, the temperature of the contact portion of which being lower than the aforesaid characteristic melting point so as to solidify the particles into essentially electrically continuous layer within the contact area and within the conductive structure in accordance with the pattern (512), wherein the thermal masses of the contact area and the at least adjacent portion of the conductive structure are configured substantially equal.

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