Abstract:
A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.
Abstract:
A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.
Abstract:
The invention refers to a method to produce a packaging material comprising the steps of; treating at least one surface of a paperboard substrate with a binder and with a metal salt, printing at least a part of said treated surface with ink, and applying at least one polymer layer on said printed surface. The packaging material produced in accordance with the invention shows good printability and simultaneously good adhesion of the applied polymer layer.
Abstract:
A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.
Abstract:
Un método para fabricar un material de embalaje que comprende los pasos de; - proporcionar un sustrato de cartulina con un gramaje de al menos 180 gsm y que comprenda fibras celulósicas, - tratar al menos una superficie de dicho sustrato con un aglutinante y con una sal metálica, - imprimir al menos una parte de dicha superficie tratada con tinta, - aplicar al menos una capa de polímero sobre dicha superficie impresa, - en donde dicho aglutinante comprende poliDADMAC y celulosa microfibrilada (MFC) o poliDADMAC y almidón, y en donde dicha capa de polímero comprende polietileno (PE) tereftalato de polietileno (PET), polipropileno (PP) y/o ácido poliláctico (PLA) y en donde dicha sal metálica es cloruro de calcio, cloruro de aluminio, cloruro de magnesio, bromuro de magnesio, bromuro de calcio, cloruro de bario, nitrato de calcio, nitrato de magnesio, nitrato de bario, acetato de calcio, acetato de magnesio o acetato de bario o una mezcla de estos y se aplica en una cantidad de 0,01 - 1 g/m2.
Abstract:
A system for monitoring the life cycle of a product even in open-loop retail environment having regard to the associated supply or value chain, comprising tag provision equipment arranged to obtain product information and to configure a wirelessly interrogatable electronic identification tag provided with externally readable identification information to a product item, wherein configuring incorporates at least partially automated determination, according to predefined decision logic, of at least one technical characteristic of tag implementation based on the product information to optimize the operation of the tag, and electronic data management system accessible via a communications network, preferably the Internet, comprising a data interface configured to receive and transmit data, and a data repository configured to store indications of received digital notifications of tag reading events in a plurality of activities of the associated supply or value chain, said notifications conveying said tag identification information. A corresponding method for execution by the system is presented.
Abstract:
Un método para transferir material conductor de electricidad que comprende metal o su aleación en forma fluida sobre un sustrato (102), que comprende: - precalentar (103) dicho sustrato a una primera temperatura, - calentar (104) dicho material conductor de electricidad que comprende dicho metal o su aleación a una segunda temperatura, que es más alta que un punto de fusión de dicho material conductor de electricidad, produciendo así un material conductor de electricidad fluido, - pulverizar (105) dicho material conductor de electricidad fluido sobre el sustrato precalentado para formar un patrón de tipo predeterminado, donde al menos esa superficie del sustrato sobre el que se proporciona el fluido está eléctricamente aislada, y - enfriar (106) el sustrato sobre el que se pulverizó dicho fluido conductor de electricidad a una tercera temperatura, que es inferior o igual a dicho punto de fusión de dicho material conductor de electricidad; caracterizado por que dicho enfriamiento comprende presionar esa superficie del sustrato, sobre la cual se roció dicho material conductor de electricidad fluido, contra un rodillo, y mantener activamente una temperatura superficial de dicho rodillo inferior a dicho punto de fusión de dicho material conductor de electricidad, donde presionar contra dicho rodillo implementa dicho enfriamiento del sustrato.
Abstract:
A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate (102). The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate (102) in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point. Fig. 1